公开(公告)号：EP4406914A1

公开(公告)日：2024-07-31

申请号：EP24153916.2

申请日：2024-01-25

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： BACKMAN, Roger Alan ,  FRINK, Sarah ,  POTASEK, David

IPC: B81C3/00 ,  G01L9/00

CPC classification number: B81C3/001 ,  B81B2201/026420130101 ,  B81B2203/031520130101 ,  B81C2201/01920130101 ,  G01L19/0654 ,  G01L9/0047

Abstract: A wafer die assembly includes a first wafer (102) having at least a central cavity (106) defined therein. The wafer die assembly includes a second wafer (112) mounted to the first wafer. At least one of the first or second wafers includes an etched pattern (104). The etched pattern including at least one peripheral cavity (108), and a raised area (110) raised relative to the peripheral cavity. A method of assembling a wafer die assembly includes etching a central cavity into a first wafer and etching a pattern into at least one of the first wafer or a second wafer. The first wafer and/or the second wafer includes a raised area raised relative to the peripheral cavity or the central cavity. The method includes bonding the second wafer to the first wafer.