公开(公告)号：EP3800661A1

公开(公告)日：2021-04-07

申请号：EP19215405.2

申请日：2019-12-11

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： BACKMAN, Roger Alan ,  POTASEK, David P.

IPC: H01L23/525 ,  H01L23/31 ,  H01L27/01 ,  H01L23/055 ,  H01L23/10 ,  B81B7/00 ,  B81C1/00

Abstract: A micro-fuse assembly includes a substrate (42), a number of thin-film micro-fuses on the substrate (42), and a topping wafer (70) configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.

公开(公告)号：EP3772641A1

公开(公告)日：2021-02-10

申请号：EP19215614.9

申请日：2019-12-12

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： POTASEK, David P. ,  BACKMAN, Roger Alan

IPC: G01L9/00 ,  G01L9/06 ,  G01L19/04

Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.

公开(公告)号：EP4406914A1

公开(公告)日：2024-07-31

申请号：EP24153916.2

申请日：2024-01-25

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： BACKMAN, Roger Alan ,  FRINK, Sarah ,  POTASEK, David

IPC: B81C3/00 ,  G01L9/00

CPC classification number: B81C3/001 ,  B81B2201/026420130101 ,  B81B2203/031520130101 ,  B81C2201/01920130101 ,  G01L19/0654 ,  G01L9/0047

Abstract: A wafer die assembly includes a first wafer (102) having at least a central cavity (106) defined therein. The wafer die assembly includes a second wafer (112) mounted to the first wafer. At least one of the first or second wafers includes an etched pattern (104). The etched pattern including at least one peripheral cavity (108), and a raised area (110) raised relative to the peripheral cavity. A method of assembling a wafer die assembly includes etching a central cavity into a first wafer and etching a pattern into at least one of the first wafer or a second wafer. The first wafer and/or the second wafer includes a raised area raised relative to the peripheral cavity or the central cavity. The method includes bonding the second wafer to the first wafer.

公开(公告)号：EP3742467A1

公开(公告)日：2020-11-25

申请号：EP19210644.1

申请日：2019-11-21

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： POTASEK, David P. ,  PING-TAO FOK, Ben ,  BACKMAN, Roger Alan

IPC: H01H69/02 ,  H01H85/10 ,  H01H85/041

Abstract: Disclosed is a thin-film micro-fuse assembly having: a substrate (116); an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor (130) disposed on the insulating layer, the conductor forming: an inlet terminal (130a), an outlet terminal (130b) and a fuse element (130c) between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.