摘要:
A process device has a process seal for coupling to an industrial process. The process device includes a process device body having an isolation cavity and an isolation passageway extending from the isolation cavity to a pressure sensor. The isolation cavity and isolation passageway filled with an isolation fluid. An isolation diaphragm is positioned to isolate the isolation cavity from process fluid. The isolation diaphragm has a process fluid side and an isolation fluid side. A weld ring is positioned around a periphery of the process fluid side of the isolation diaphragm. The weld ring is formed of a first material compatible with the isolation diaphragm and a second material compatible with the process device body. A weld secures the weld ring to the process device body.
摘要:
A pressure transmitter with pressure sensor mount includes pressure measurement circuitry. A metal body of the pressure transmitter has a pressure coupling configured to couple to a process pressure. A pressure sensor is configured to provide an output related to an applied pressure to the pressure measurement circuitry. A conduit is coupled to the pressure sensor and configured to apply an applied pressure corresponding to the process pressure to pressure sensor. A non-conductive spacer is configured to electrically isolate the conduit from the metal body. The non-conductive spacer has an opening formed therein and is arranged to convey the applied from the metal body to the conduit.
摘要:
A pressure transmitter (100) comprises a metal wall (102) separating a process pressure chamber (104) from an electronics compartment (106). The metal wall (102) has a stepped bore (108) with a bore shelf (110) facing the process pressure chamber (104). A metal header (112) has a stepped outer rim (114) with a header shelf that contacts the bore shelf. The metal header (112) includes at least one electrical feedthrough (122,124) with a glass-to-metal seal (126,128) adjacent the stepped outer rim (114). A welded seal (130) seals the stepped outer rim to the stepped bore.
摘要:
A differential pressure transmitter (200; 300; 400; 500; 600; 700) includes first (210; 310) and second (212;312) process fluid inlets. A differential pressure sensor (214; 338; 518; 638) is disposed within the transmitter (200; 300; 400; 500; 600; 700) and has first and second sensor inlets. A first isolator diaphragm (230; 330) is located proximate the first process fluid inlet (210; 310) and is operably coupled to the first sensor inlet through a first fill fluid volume (334). A second isolator diaphragm (232; 332) is located proximate the second process fluid inlet (212;312) and is operably coupled to the second sensor inlet through a second fill fluid volume (336). Measurement circuitry (218) is operably coupled to the differential pressure sensor (214; 338; 518; 638) and configured to measure an electrical parameter of the sensor (214; 338; 518; 638) and provide an indication of the measured parameter. A third fluid volume (354) substantially surrounds the differential pressure sensor. The third fluid volume (354) exerts a compressive force on the differential pressure sensor (214; 338; 518; 638).
摘要:
A pressure sensor (10) is provided for measuring a pressure difference between two fluids which does not require isolation fluid. The pressure sensor includes a diaphragm support member (12) having an outer periphery and diaphragms coupled thereto. Movement of the diaphragms (16A, 16B) are the movement of a moveable member (20). The movement can be sensed to determine the applied differential pressure. The coupling member is joined to the outer periphery with a web. The web is recessed from opposed outwardly facing surfaces of the outer periphery, and first and second diaphragms disposed on opposite sides of the diaphragm support member. Each diaphragm is joined to the outer periphery and to the coupling member.
摘要:
A process device has a process seal for coupling to an industrial process. The process device includes a process device body having an isolation cavity and an isolation passageway extending from the isolation cavity to a pressure sensor. The isolation cavity and isolation passageway filled with an isolation fluid. An isolation diaphragm is positioned to isolate the isolation cavity from process fluid. The isolation diaphragm has a process fluid side and an isolation fluid side. A weld ring is positioned around a periphery of the process fluid side of the isolation diaphragm. The weld ring is formed of a first material compatible with the isolation diaphragm and a second material compatible with the process device body. A weld secures the weld ring to the process device body.
摘要:
An isolated connection is formed by growing interconnects from the grain growth of an electrically conductive grain growth material (16) inside an MEMS device (10) after the device (10) is bonded together. The material used for grain growth of electrical contacts is deposited inside a cavity (18) formed between first (12) and second layers (12) of the device (10).
摘要:
An isolated connection is formed by growing interconnects from the grain growth of an electrically conductive grain growth material (16) inside an MEMS device (10) after the device (10) is bonded together. The material used for grain growth of electrical contacts is deposited inside a cavity (18) formed between first (12) and second layers (12) of the device (10).
摘要:
A micromachined device (32) receiving a pressurizable fluid has a plurality of layers (34, 36) bonded together along at least one bond interface (35), the bond interface having a terminus bordering the pressurizable fluid. In a vicinity of at least one bond interface (35) at least one layer (34, 36) has a shape that reduces a stress magnitude near the bond terminus. In a preferred embodiment a width of at least one layer (34) increases toward the bond interface (35), to increase the pressure at which the device can operate without fracturing. In another embodiment, both layers (34, 36) bordering the bond interface (35) have widths in the vicinity of the bond interface (35) that increase toward the bond interface (35). Alternately, the layers (34, 36) have walls shaped such that, for a reference line perpendicular to the bond interface (35) and passing through an end of the bond interface (35) bordering the cavity, the cavity protrudes between the reference line and at least one of the walls.