公开(公告)号：EP3403475A1

公开(公告)日：2018-11-21

申请号：EP16805930.1

申请日：2016-11-11

申请人： Raytheon Company

发明人： NEUMANN, Jay R. ,  MCEWAN, Thomas F. ,  SIGURDSON, David E. ,  PEREZ, Alberto ,  LAMBE, Janine F. ,  TRACY, Gregory D.

IPC分类号： H05K3/46 ,  H01P3/08 ,  H04N5/225 ,  H04M1/02 ,  G06F1/18 ,  H05K1/02

CPC分类号： H01B7/04 ,  G06F13/20 ,  H01L27/14636 ,  H01L27/14652 ,  H01P3/08 ,  H01R12/79 ,  H04M1/0264 ,  H04N5/2253 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0284 ,  H05K3/4691 ,  H05K5/0069 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  Y02D10/14

摘要： A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

公开(公告)号：EP3440701A1

公开(公告)日：2019-02-13

申请号：EP17719955.1

申请日：2017-03-30

申请人： Raytheon Company

发明人： NEUMANN, Jay R. ,  RANDOLPH, Peter M. ,  FULK, Chad W.

IPC分类号： H01L27/146