利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.008 秒)

    MEMS MICROPHONE PACKAGE WITH MOLDED INTERCONNECT DEVICE
    3.
    发明公开
    MEMS MICROPHONE PACKAGE WITH MOLDED INTERCONNECT DEVICE 审中-公开
    微机电一体机MIT EINER GEFORMTEN VERBINDUNGSVORRICHTUNG

    公开(公告)号：EP2893713A1

    公开(公告)日：2015-07-15

    申请号：EP13765586.6

    申请日：2013-09-10

    申请人： Robert Bosch GmbH

    发明人： OCHS, Eric ,  SALMON, Jay, S.

    IPC分类号： H04R1/04 ,  B81B7/00

    摘要： A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.

    摘要翻译： 描述了一种麦克风包，其包括塑料盖，基底和两个电组件。 塑料盖包括第一导电盖迹线，并且基板基底包括第一导电基板迹线。 塑料盖可密封地联接到基底基底以形成密封腔。 衬底迹线和盖迹线被布置成使得当空腔被密封时，在衬底迹线和盖迹线之间形成电连接。 第一部件安装在基板基板上并电耦合到基板迹线。 第二部件安装在盖子上并且电耦合到盖子轨迹。 衬底迹线和盖迹线之间的电连接提供第一部件和第二部件之间的电耦合。 第一部件和第二部件中的至少一个包括MEMS麦克风管芯。

    CAVITY PACKAGE DESIGN
    4.
    发明公开
    CAVITY PACKAGE DESIGN 有权
    CAVITY包装设计

    公开(公告)号：EP2830989A1

    公开(公告)日：2015-02-04

    申请号：EP13714405.1

    申请日：2013-03-14

    申请人： Robert Bosch GmbH

    发明人： OCHS, Eric ,  SALMON, Jay, S.

    IPC分类号： B81C1/00

    CPC分类号： B81B7/0074 ,  B81B7/0077 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00309 ,  B81C1/0065

    摘要： A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.

    摘要翻译： 半导体器件。 该器件包括具有电迹线的衬底，安装在衬底上的MEMS管芯和半导体芯片中的至少一个，以及间隔件。 间隔件具有连接到衬底的第一端并且包括耦合到电迹线的电互连。 该至少一个MEMS管芯和半导体芯片被包含在该间隔件内。 间隔件和衬底形成包含至少一个MEMS管芯和半导体芯片的空腔。 当半导体器件经由间隔件的第二端安装到电路板时，腔形成声学体积。