公开(公告)号：EP2057093A1

公开(公告)日：2009-05-13

申请号：EP07841345.7

申请日：2007-08-24

申请人： Robert Bosch GmbH

发明人： VANCURA, Cyril ,  ULM, Markus ,  STARK, Brian ,  METZ, Matthias ,  FUCHS, Tino ,  LAERMER, Franz ,  KRONMUELLER, Silvia

IPC分类号： B81C1/00

CPC分类号： B81C1/0096 ,  B81B3/0005

摘要： An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 0C is described. The coating is applied after device release but before sealing vents in the encapsulation layer Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.