公开(公告)号：EP1693484A2

公开(公告)日：2006-08-23

申请号：EP06250733.0

申请日：2006-02-10

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Montano, Joseph R. ,  Reese, Jason A. ,  Little, Luke W.

IPC: C23C18/16 ,  C23C18/28 ,  C23C18/18 ,  C25D5/54

CPC classification number: H05K3/387 ,  C23C18/1651 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2086 ,  C25D5/54 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0236

Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

Abstract translation: 提供了提高金属层与基板（例如光学基板）的粘附性的方法。 这样的方法在金属沉积之前在基板上使用包含镀催化剂的粘合促进组合物层。 还提供了通过这些过程制造的装置。

公开(公告)号：EP1693484A3

公开(公告)日：2007-06-20

申请号：EP06250733.0

申请日：2006-02-10

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Montano, Joseph R. ,  Reese, Jason A. ,  Little, Luke W.

IPC: C23C18/16 ,  C23C18/28 ,  C23C18/18 ,  C25D5/54

CPC classification number: H05K3/387 ,  C23C18/1651 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2086 ,  C25D5/54 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0236

Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.