公开(公告)号：EP3189097A4

公开(公告)日：2018-04-18

申请号：EP15837858

申请日：2015-06-05

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MAO BIFENG

IPC: C08K3/22 ,  C08L67/02 ,  C08L69/00 ,  C08L77/06 ,  C23C18/06 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：EP3189268A1

公开(公告)日：2017-07-12

申请号：EP15736853.1

申请日：2015-07-20

Applicant: DSM IP Assets B.V.

Inventor： FRISSEN, Richard Jacques Theodoor ,  SUBRAMONIAN, Siva Esakimuthu

IPC: F21K99/00

CPC classification number: C08K7/14 ,  B60Q1/0483 ,  B60Q1/18 ,  C08K3/013 ,  C08K5/0008 ,  F21S41/141 ,  F21S43/14 ,  F21Y2115/10 ,  H01L33/62 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0145 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Light emitting diode (LED) based daylight running light (DRL) comprising a carrier, comprising a polymer composition comprising polyethylene terephthalate and glass fibers, the surface of the carrier comprises conductor tracks for mounting one or more LED's.

Abstract translation: 包括载体的基于发光二极管（LED）的日光行驶灯（DRL）包括包含聚对苯二甲酸乙二醇酯和玻璃纤维的聚合物组合物，载体的表面包括用于安装一个或多个LED的导体轨道。

公开(公告)号：EP2899236B1

公开(公告)日：2017-07-05

申请号：EP13836606.7

申请日：2013-09-05

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou ,  AKASHI Naohisa

IPC: C08L101/00 ,  C08K3/22 ,  C08K7/14 ,  C08L77/00 ,  C23C18/20 ,  C23C18/30 ,  H01Q1/38 ,  C23C18/38 ,  H05K1/09 ,  H05K3/18

CPC classification number: C23C18/285 ,  C08G69/265 ,  C08K3/22 ,  C08K3/2279 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L53/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO 2 and Al 2 O 3 in a proportion of 60 to 70 % by weight of SiO 2 and 20 to 30 % by weight of Al 2 O 3 .

Abstract translation: 提供一种热塑性树脂组合物，可以在保持树脂成型品的镀敷性的同时获得白度和机械强度高的树脂成型品。 1。一种热塑性树脂组合物，其包含热塑性树脂和1至30重量份的激光直接成型添加剂，0.1至20重量份的氧化钛和10至230重量份的玻璃纤维/ 100重量份的 其中所述激光直接成型添加剂具有50以上的L值，并且所述玻璃纤维包含SiO 2和Al 2 O 3，其中SiO 2和Al 2 O 3的比例为SiO 2 60-70重量％和20-30重量％ Al 2 O 3的重量。

公开(公告)号：EP3146812A1

公开(公告)日：2017-03-29

申请号：EP15708363.5

申请日：2015-02-05

Applicant: Sierra Circuits Inc.

Inventor： KARAVAKIS, Konstantine ,  BAHL, Kenneth S.

IPC: H05K3/42

CPC classification number: H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

Abstract translation: 印刷电路板中的通孔由图案化的金属层组成，该图案金属层延伸穿过电介质层压材料中的孔，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层压材料的一部分涂覆在孔周围。 图案化的金属层被放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

公开(公告)号：EP2991080A4

公开(公告)日：2016-10-19

申请号：EP14848019

申请日：2014-09-22

Applicant: LG CHEMICAL LTD

Inventor： JUN SHIN HEE ,  PARK CHEE-SUNG ,  KIM JAE HYUN ,  JUNG SANG YUN ,  PARK CHEOL-HEE

IPC: H01B1/22 ,  C23C18/16 ,  C23C18/18 ,  H01B5/14 ,  H01B13/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18

CPC classification number: H05K1/092 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08K3/22 ,  C08L69/00

公开(公告)号：EP2999665A1

公开(公告)日：2016-03-30

申请号：EP14801718.9

申请日：2014-05-23

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  MIAO, Weifeng

IPC: C01G19/02 ,  C23C18/20 ,  C08K3/22 ,  C08L69/00 ,  C23C18/52

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: A method for selective metallization of a surface of a polymer article is provided. The polymer article contains a base polymer and at least one metal compound dispersed in the base polymer. The method includes gasifying at least a part of a surface of the polymer article by irradiating the surface with an energy source, and forming at least one metal layer on the surface of the polymer article by chemical plating. The metal compound contains a tin oxide doped with at least one doping element selected from a group including: V, Sb, In, and Mo.

公开(公告)号：EP2676799B1

公开(公告)日：2014-06-11

申请号：EP12760231.6

申请日：2012-03-16

Applicant: Mitsubishi Chemical Europe GmbH ,  Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou ,  SCHRAUWEN, Bernardus Antonius Gerardus

IPC: B41M5/26 ,  H05K1/03 ,  C08J5/04 ,  C08L77/00 ,  C08K3/22 ,  C08K9/02 ,  C08L55/02 ,  H05K3/18

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

公开(公告)号：EP2724422A1

公开(公告)日：2014-04-30

申请号：EP12734798.7

申请日：2012-06-15

Applicant: Reichle & De-Massari AG

Inventor： SCHWEIZER, Dominik

IPC: H01R13/03 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H01R43/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/6463 ,  H01R13/035 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H01R43/18 ,  H01R43/26 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  Y10T29/49208

Abstract: According to one aspect of the invention, a plug for an electrical plug connector is provided, which comprises, in a manner which in itself is known, a plurality of plug contacts (6.1) which are or can be electrically connected to a corresponding number of connecting elements, such as cutting clamps, clamp contacts or possibly also soldering sites, for connecting to a respective cable core. The plug is characterized in that, for each plug contact, a conductor is formed as a conductor path (6) which has been grown 3-dimensionally on the surface of a plug body (1) formed as a cast plastic part, and which adheres to said surface, and said conductor constitutes the plug contact (6.1) and also electrically connects the latter to the connecting element.

公开(公告)号：EP2676799A1

公开(公告)日：2013-12-25

申请号：EP12760231.6

申请日：2012-03-16

Applicant: Mitsubishi Chemical Europe GmbH ,  Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou ,  SCHRAUWEN, Bernardus Antonius Gerardus

IPC: B41M5/26 ,  H05K1/03 ,  C08J5/04 ,  C08L77/00 ,  C08K3/22 ,  C08K9/02 ,  C08L55/02 ,  H05K3/18

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. THe thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 本发明提供一种具有优异的弯曲强度，弯曲模量和却贝冲击强度，在其上镀敷层可以在一个成功的方式形成的热塑性树脂成形体。 用于激光直接结构化热塑性树脂组合物按重量计的激光直接结构化添加剂，其包括，每100份（重量）热塑性树脂，10〜150重量份的无机纤维和1〜30重量份，所述激光直接结构化添加剂含 铜，锑和锡，和具有1.5的莫氏硬度或大于所述无机纤维的莫氏硬度更小一些中的至少一个。

公开(公告)号：EP2257139A1

公开(公告)日：2010-12-01

申请号：EP09161125.1

申请日：2009-05-26

Applicant: Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO

Inventor： Korbee, Roland Alexander

IPC: H05K3/18

CPC classification number: H05K3/182 ,  H05K1/0373 ,  H05K3/188 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1157 ,  H05K2203/125

Abstract: Method for manufacturing an article of a synthetic material comprising a body part (4) and a metallizable part (5), comprising the steps of manufacturing the body part by any suitable method; providing that the body part is located within an injection mold (1); providing a mixture of a thermoplastic material (7), a metal compound (9) and a suitable compound reduction agent (11); heating said mixture;
feeding the mixture to the injection mold; cooling the injection mold; releasing the article, including the body part and the metallizable part, from the injection mold; removing any remaining reduction agent and/or remaining metal compound from the metallizable part. The result is an article comprising a porous metallizable part (5) including metal metallization germs, which part can be metallized, either electroless or non-electroless.

Abstract translation: 一种用于制造合成材料的制品的方法，包括主体部分（4）和可金属化部分（5），包括通过任何合适的方法制造主体部分的步骤; 使得所述主体部分位于注射模具（1）内; 提供热塑性材料（7），金属化合物（9）和合适的化合物还原剂（11）的混合物; 加热混合物; 将混合物进料到注射模具中; 冷却注塑模具; 从注射模具释放包括身体部位和金属化部分的物品; 从金属化部分去除任何剩余的还原剂和/或剩余的金属化合物。 结果是包括多孔金属化部分（5）的制品，其包括金属金属化细菌，该部分可以金属化，无电解或非化学镀。