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公开(公告)号:EP1477587A3
公开(公告)日:2007-04-04
申请号:EP04252548.5
申请日:2004-04-30
CPC分类号: H05K3/244 , C25D5/022 , C25D5/10 , C25D5/34 , H01L2924/0002 , H05K3/383 , H05K2203/0392 , H01L2924/00
摘要: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented from forming or the number of whiskers is reduced in number as well as size.
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公开(公告)号:EP1477587A2
公开(公告)日:2004-11-17
申请号:EP04252548.5
申请日:2004-04-30
CPC分类号: H05K3/244 , C25D5/022 , C25D5/10 , C25D5/34 , H01L2924/0002 , H05K3/383 , H05K2203/0392 , H01L2924/00
摘要: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented from forming or the number of whiskers is reduced in number as well as size.
摘要翻译: 在基板上镀锡或锡合金以防止晶须形成或晶须数量的方法减少了数量和尺寸。
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