公开(公告)号：EP2778260A2

公开(公告)日：2014-09-17

申请号：EP14159759.1

申请日：2014-03-14

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： JAYARAJU, Nagarajan ,  NAJJAR, Elie H. ,  BARSTAD, Leon R.

IPC: C25D3/38 ,  C25D5/02 ,  C25D5/10 ,  C25D5/34 ,  H05K3/00

CPC classification number: C25D5/34 ,  C23C18/1653 ,  C25D3/38 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  H05K3/423

Abstract: The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.

Abstract translation: 该方法在诸如印刷电路板的基板中的具有闪蒸铜层的通孔的铜电镀期间抑制或减少凹坑和空隙。 将包含芳族杂环氮化合物和含环氧化合物的反应产物的酸性溶液施加到基材的通孔，然后使用包括添加剂如增白剂和均化剂的铜电镀浴将铜填充通孔。

公开(公告)号：EP2778260A3

公开(公告)日：2015-06-03

申请号：EP14159759.1

申请日：2014-03-14

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： JAYARAJU, Nagarajan ,  NAJJAR, Elie H. ,  BARSTAD, Leon R.

IPC: C25D3/38 ,  C25D5/02 ,  C25D5/10 ,  C25D5/34 ,  H05K3/00

CPC classification number: C25D5/34 ,  C23C18/1653 ,  C25D3/38 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  H05K3/423

Abstract: The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.

公开(公告)号：EP3009533A1

公开(公告)日：2016-04-20

申请号：EP15189090.2

申请日：2015-10-09

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： JAYARAJU, Nagarajan Rohm and Haas Electronic Materials LLC. ,  BARSTAD, Leon R. ,  NAJJAR, Elie H.

IPC: C25D7/12 ,  C25D5/18 ,  H05K3/42

CPC classification number: H05K3/424 ,  C25D3/38 ,  C25D5/18 ,  C25D7/00 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/1492

Abstract: Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.

Abstract translation: 包括正向脉冲但没有反向脉冲的脉冲电镀方法抑制或减少在诸如印刷电路板的基板中的通孔的铜电镀期间的凹坑和空隙。 脉冲电镀方法可以用铜填充通孔，其中通孔用无电铜或闪铜覆盖。