公开(公告)号：EP2442367B1

公开(公告)日：2014-07-16

申请号：EP11185113.5

申请日：2011-10-13

申请人： Rohm and Haas Electronic Materials LLC ,  Alliance for Sustainable Energy, LLC

发明人： Reddington, Erik ,  Sutter, Thomas C. ,  Bu, Lujia ,  Perras, Alexandra ,  Habas, Susan E. ,  Curtis, Calvin J. ,  Miedaner, Alexander ,  Ginley, David S. ,  Van Hest, Marinus Franciscus Antonius Maria

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022425 ,  C09D11/322 ,  C09D11/52 ,  Y02E10/50

公开(公告)号：EP2442367A3

公开(公告)日：2013-05-22

申请号：EP11185113.5

申请日：2011-10-13

申请人： Rohm and Haas Electronic Materials LLC ,  Alliance for Sustainable Energy, LLC

发明人： Reddington, Erik ,  Sutter, Thomas C. ,  Bu, Lujia ,  Perras, Alexandra ,  Habas, Susan E. ,  Curtis, Calvin J. ,  Miedaner, Alexander ,  Ginley, David S. ,  Van Hest, Marinus Franciscus Antonius Maria

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022425 ,  C09D11/322 ,  C09D11/52 ,  Y02E10/50

摘要： Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.

公开(公告)号：EP2442367A2

公开(公告)日：2012-04-18

申请号：EP11185113.5

申请日：2011-10-13

申请人： Rohm and Haas Electronic Materials LLC ,  National Renewable Energy Laboratory

发明人： Reddington, Erik ,  Sutter, Thomas C. ,  Bu, Lujia ,  Perras, Alexandra ,  Habas, Susan E. ,  Curtis, Calvin J. ,  Miedaner, Alexander ,  Ginley, David S. ,  Van Hest, Marinus Franciscus Antonius Maria

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022425 ,  C09D11/322 ,  C09D11/52 ,  Y02E10/50

摘要： Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.

摘要翻译： 公开了在制造光伏器件中与金属油墨形成金属接触的方法。 金属油墨通过喷墨和气溶胶装置选择性地沉积在半导体涂层上。 将复合材料加热至选择性温度，其中金属油墨通过涂层燃烧以与半导体形成电接触。 然后通过光诱导或光辅助电镀将金属层沉积在电触点上。

公开(公告)号：EP2876123A1

公开(公告)日：2015-05-27

申请号：EP14194650.9

申请日：2014-11-25

申请人： Rohm and Haas Electronic Materials LLC

发明人： Gilmore, Christopher D. ,  Bu, Lujia ,  Chuang, Peng-Wei ,  Kiarie, Cecilia Waithera ,  Kim, Young Seok ,  O'Connell, Kathleen M.. ,  Caporale, Stephan J.

IPC分类号： C08G61/10 ,  C08G61/12 ,  C09D165/02 ,  C08L65/02 ,  H01L23/14 ,  H01L23/498 ,  H01L23/532 ,  H01B3/30

CPC分类号： C09D171/00 ,  C08G61/10 ,  C08G61/12 ,  C08G65/002 ,  C08L65/02 ,  C09D165/02 ,  H01B3/307 ,  H01B19/04 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： Certain polyphenylene oligomers having good solvent strip resistance, low coefficient of thermal expansion and good adhesion to a variety of surfaces are useful as thin-film dielectric materials in electronics applications.

摘要翻译： 具有良好耐溶剂剥离性，低热膨胀系数和对各种表面的良好粘附性的某些聚亚苯基低聚物可用作电子应用中的薄膜电介质材料。