Method for beam welding on components
    2.
    发明公开
    Method for beam welding on components 审中-公开
    Verfahren zumStrahlschweißenauf Komponenten

    公开(公告)号:EP2444194A1

    公开(公告)日:2012-04-25

    申请号:EP11184089.8

    申请日:2011-10-06

    摘要: In a method for beam welding on components (2) with a laser beam (4) or electron beam generated by a beam source (10), the heat treatment of the welded component required to remove stresses is integrated into the welding process. In a work cycle combined with the welding process, a regulated heat supply to a selected region (6,8) takes place, according to its residual heat resulting from the welding process and the predicted stresses in that region, using the residual heat remaining from the welding process following the welding process from the same or other beam source(s). The welding region is cooled in a controlled manner, so that welded components which are likely to be subject to high stress in use, provided for example for a aircraft engine, can be made available without inherent stresses and with the desired microstructure in a single - combined - work step. On the one hand, the method is cost-effective because the labour input is small due to the combined processing in one and the same device. On the other hand, the outlay on equipment is reduced, since a separate expensive heat treatment device, in which the component is either completely or locally heat-treated, may not be required or could be required for a substantially shorter period. Moreover, a post-treatment of the component, for example by shot-blasting, which may be necessitated by the separate heat treatment of the component, is potentially dispensed with.

    摘要翻译: 在用激光束(4)或由光束源(10)产生的电子束的部件(2)上进行束焊接的方法中,消除应力所需的焊接部件的热处理被集成到焊接过程中。 在与焊接过程相结合的工作循环中,根据焊接过程产生的剩余热量和该区域的预测应力,使用剩余的剩余热量,对选定区域(6,8)进行调节热供应 来自相同或其他束源的焊接过程之后的焊接过程。 焊接区域以受控的方式冷却,使得例如为飞机发动机提供的可能受到高应力的焊接部件可以在没有固有应力的情况下提供,并且具有期望的微结构, 组合 - 工作步骤。 一方面,由于在同一设备中的组合处理,劳动输入量小,因此该方法具有成本效益。 另一方面,减少了设备的费用,因为可能不需要或可能需要在短时间内单独的昂贵的热处理装置,其中组件完全或局部热处理。 此外,可能省去了组件的后处理,例如通过单独热处理组件可能需要的喷丸。