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公开(公告)号:EP3090010A4
公开(公告)日:2017-08-23
申请号:EP14876316
申请日:2014-12-08
CPC分类号: C08L71/123
摘要: Disclosed herein are non-dusting poly(phenylene ether) particles comprising 80 to 96 weight percent of poly(phenylene ether) particles having a mean particle size of 1 to 40 micrometers; and 4 to 20 weight percent of a liquid reactive diluent. Poly(alkenyl aromatic) resins, rubber-modified poly(alkenyl aromatic) resins, and hydrogenated, partially hydrogenated, and non-hydrogenated block copolymers of an alkenyl aromatic monomer and a conjugated diene are all excluded from the particles. The liquid reactive diluent is selected from a first polyol having at least two hydroxyl groups per molecule, a first epoxy resin, a first ethylenically unsaturated monomer, a polyether-modified polysiloxane, and combinations thereof. Also disclosed are compositions comprising the non-dusting poly(phenylene ether) particles and a thermoset composition, wherein the liquid reactive diluent is reactive with the components of the thermoset composition.
摘要翻译: 本文公开了包含80至96重量%的平均粒度为1至40微米的聚(亚苯基醚)颗粒的无粉化聚(亚苯基醚)颗粒; 和4至20重量%的液体反应性稀释剂。 链烯基芳族单体和共轭二烯的聚(链烯基芳族化合物)树脂,橡胶改性的聚(链烯基芳族化合物)树脂和氢化的,部分氢化的和非氢化的嵌段共聚物都被排除在颗粒之外。 液体反应性稀释剂选自每分子具有至少两个羟基的第一多元醇,第一环氧树脂,第一烯属不饱和单体,聚醚改性聚硅氧烷及其组合。 还公开了包含无尘聚(亚苯基醚)颗粒和热固性组合物的组合物,其中液体反应性稀释剂与热固性组合物的组分反应。
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公开(公告)号:EP3221402A4
公开(公告)日:2018-06-06
申请号:EP15860921
申请日:2015-09-24
CPC分类号: C09D171/12 , B32B5/02 , B32B5/022 , B32B5/08 , B32B5/22 , B32B5/26 , B32B2250/20 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2262/14 , B32B2264/02 , B32B2264/0214 , B32B2307/204 , B32B2457/08 , C08J5/043 , C08J5/24 , C08J2363/02 , C08J2363/04 , C08J2371/12 , C08J2379/04 , C08J2471/12 , C08L71/12 , C09D7/001 , C09D7/20 , C09D163/00 , C09D163/04 , C09D179/04 , C08L63/00 , C08L79/04 , C08L9/00 , C08L83/04
摘要: A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.
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