摘要:
An image sensing apparatus (1) with artificial ommatidia includes an imaging optical lens group (10) forming a curved focal surface, an artificial ommatidia unit (20) having a curved top surface (21) corresponding to the curved focal surface and a flat bottom surface (22), and an image sensor (30) disposed under the artificial ommatidia unit. The artificial ommatidia unit (20) is disposed under the imaging optical lens group (10) so that the curved top surface (21) is coincided with the curved focal surface (11) of the imaging optical lens group. The artificial ommatidia unit having a plurality of artificial ommatidia (25) collects light emitting from the imaging optical lens group, and guides the light to the bottom surface thereof.
摘要:
A wafer level package for a surface acoustic wave device (100) and a fabrication method thereof include a SAW device (110) formed with a SAW element (112) on an upper surface of a device wafer (111); a cap wafer (120) joined on an upper part of the SAW element; a cavity part (130) housing the SAW element between the cap wafer and the SAW device; a cap pad (121) formed on an upper surface of the cap wafer; and a metal line (122) formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.
摘要:
A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.
摘要:
A micro-mirror device package including a micro-mirror device; a substrate, on which the micro-mirror device is mounted; and a window lid mounted on the substrate to cover the micro-mirror device. The window lid has a light transmitting part, which is sloped in relation to the micro-mirror device, and through which laser beams are transmitted to the micro-mirror device, and supporting parts downwardly extending from the light transmitting part. When a laser beam is inputted, the package separates the laser beam from noise beams, thereby improving the quality of image on a screen. By fabricating an array of window lids which correspond to micro-mirror devices, respectively, it is possible to fabricate the above-mentioned micro-mirror device package through a batch process performed in terms of a wafer size.
摘要:
A reel driving apparatus for a tape recorder includes two reel tables 10 and 20 and a plurality of intermediate gears 40 and 50 for connecting driving gears 30 with each other. The power is transmitted to the reel tables via the intermediate gears according to the rotating direction of the driving gear, thereby accomplishing a rapid mode change. Further, in the apparatus, tape loosening does not occur.
摘要:
A pattern projecting apparatus usable with a three-dimensional imaging apparatus includes a light generator which emits a light beam, and a pattern adjusting unit disposed in front of the light generator. The pattern adjusting unit forms a projection pattern on an object, and adjusts a focus of the light beam emitted from the light generator.
摘要:
An image forming element, a fabricating method of the image forming element, and an image forming apparatus having the image forming element is provided. The image forming element includes a drum body, a driving circuit mounted within the drum body, a support plate which penetrates through the drum body longitudinally along the drum body, the support plate being coupled to the driving circuit, an insulating layer formed on at least one portion of an outer circumference of the drum body, a conductive polymer layer formed on the insulating layer, the conductive polymer layer including one or more conductive areas and one or more insulating areas, which are aligned in an alternating pattern, and a protective layer formed on the conductive polymer layer, wherein the conductive areas on the conductive polymer layer are electrically connected to the driving circuit. Therefore, an image forming element can be provided in which a conductive layer is formed so that conductive areas and insulating areas are patterned without stepped portions therebetween, simplifying the fabricating process and improving the precision.