公开(公告)号：EP2301076A2

公开(公告)日：2011-03-30

申请号：EP09780742.4

申请日：2009-07-16

申请人： SCHOTT Solar AG

发明人： VON CAMPE, Hilmar ,  MEIDEL, Bernd ,  GRIES, Georg ,  WILL, Christoph ,  ROSSA, Jürgen

IPC分类号： H01L31/02 ,  H01L31/05 ,  H01L31/18

CPC分类号： H01L31/022425 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/262 ,  B23K2201/42 ,  H01L31/03762 ,  H01L31/03921 ,  H01L31/048 ,  H01L31/0504 ,  H01L2224/8592 ,  Y02E10/548

摘要： The invention relates to a soldered connection between an outer surface (23) of a semiconductor device (10), connected to a substrate (12) by means of an adhesive layer (14), and a connector (24) in the form of a strip. In order that tensile forces acting on the connector do not cause the semiconductor device to be detached from the substrate or the adhesive layer, it is proposed that from the outer surface (23) of the semiconductor device (10) there extends a supporting location (26, 28), which consists of solderable material and makes contact with the outer surface (23) by way of a contact surface A, in or on which the connector (24) is soldered while maintaining a distance a from the outer surface (33) where a ≥ 10 µm, and/or that the distance b between the edge of the contact surface between the supporting surface and the outer surface and the entry of the connector into the supporting location or the beginning of contact between them is b ≥ 50 µm.

摘要翻译： 在半导体器件的外表面之间的焊接连接，通过粘合剂层连接到衬底，以及带状形式的连接器。 为了使作用在连接器上的拉伸力不会导致半导体器件从衬底或粘合剂层分离，因此提出支撑位置从半导体器件的外表面延伸，该支撑位置由可焊接的 材料，并且通过接触表面A与外表面接触，其中连接器被焊接在其中或其上，同时保持与外表面的距离a≥10μ; 和/或支撑表面和外表面之间的接触表面的边缘与连接器进入支撑位置或其间的接触开始处之间的距离b为b≥50μ。