Abstract:
The invention concerns a plasma generating apparatus, for manufacturing devices having patterned layers, comprising a first electrode assembly (1) and a second electrode assembly (2) placed in a plasma reactor chamber, an electrical power supply (6) for generating a voltage difference between the first electrode assembly (1) and the second electrode assembly (2). According to the invention, the second electrode assembly (2) is configured for receiving a substrate (5), and the first electrode assembly (1) comprises a plurality of protrusions (11) and a plurality of recesses (12, 13, 14, 15, 16, 17, 18), the protrusions (11) and recesses (12, 13, 14, 15, 16, 17, 18) being dimensioned and set at respective distances (D1, D2) from the surface (51) of the substrate (5) so as to generate a plurality of spatially isolated plasma zones (21, 22) located selectively either between said surface (51) of the substrate (5) and said plurality of recesses (12, 13, 14, 15, 16, 17, 18) or between said surface (51) of the substrate (5) and said plurality of protrusions (11).
Abstract:
Provided is an integrated-type thin film photoelectric converter having a high conversion characteristic which can be manufactured at a high productivity and a low cost. The integrated-type thin film photoelectric converter includes a transparent conductive layer, a laser light absorption layer, a back electrode layer, a semiconductor photoelectric conversion layer and a transparent electrode layer, sequentially stacked on a translucent substrate. The laser light absorption layer is parted into a plurality of regions by first kind parting line grooves, and the photoelectric conversion layer is parted into a plurality of photoelectric conversion regions by third kind parting line grooves penetrating the laser light absorption layer, the rear surface electrode layer and the photoelectric conversion layer. The transparent electrode layer is parted into a plurality of transparent electrode regions by fourth kind parting line grooves penetrating the laser light absorption layer the rear surface electrode layer, the photoelectric conversion layer and the transparent electrode layer. Between mutually adjacent photoelectric conversion cells, a back electrode region of one cell is electrically connected to a back electrode region of another cell through the first kind parting line groove, the transparent conductive layer and the third kind parting line groove. In Embodiment 1, the back electrode layer is divided into a plurality of back electrode regions by second kind parting line grooves penetrating the transparent conductive layer, the laser light absorption layer and the back electrode layer.
Abstract:
A silicon solar cell has doped amorphous silicon contacts formed on a tunnel silicon oxide layer on a surface of a silicon substrate. High temperature processing is unnecessary in fabricating the solar cell.
Abstract:
Provided is a photodetector including a graphene p-n homogeneous vertical-junction diode by evaluating photodetection characteristics of the manufactured graphene p-n vertical junction according to the amount of doping. The photodetector comprises a substrate and graphene having a p-n homogeneous vertical junction as a photodetection layer formed on the substrate, wherein the photodetection layer has a detectability of 10E11 (Jones) or higher within the range of 350nm to 1100nm, and first and second electrodes are formed on the photodetection layer.
Abstract:
The thin-film photoelectric conversion device of the present invention includes: a transparent electroconductive film (4) having zinc oxide as a main component; a contact layer (5); a photoelectric conversion unit (6) having a p-type semiconductor layer, an i-type semiconductor layer and an n-type semiconductor layer in this order; and a back electrode layer (8), in this order, on one main surface of a substrate (2). The contact layer (5) has an intrinsic crystalline semiconductor layer (51) and a p-type crystalline semiconductor layer (52) in this order from the substrate (2) side, and the intrinsic crystalline semiconductor layer (51) of the contact layer (5) and the transparent electroconductive film (4) are in contact with each other. The p-type crystalline semiconductor layer (52) of the contact layer (5) is preferably a layer having as a main component a silicon alloy selected from the group consisting of a silicon oxide; a silicon nitride; and silicon carbide.
Abstract:
To provide a resource-saving photoelectric conversion device with excellent photoelectric conversion characteristics. Thin part of a single crystal semiconductor substrate, typically a single crystal silicon substrate, is detached to structure a photoelectric conversion device using a thin single crystal semiconductor layer, which is the detached thin part of the single crystal semiconductor substrate. The thin part of the single crystal semiconductor substrate is detached by a method in which a substrate is irradiated with ions accelerated by voltage, or a method in which a substrate is irradiated with a laser beam which makes multiphoton absorption occur. A so-called tandem-type photoelectric conversion device is obtained by stacking a unit cell including a non-single-crystal semiconductor layer over the detached thin part of the single crystal semiconductor substrate.