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    RESIN FOR THERMAL IMPRINTING, RESIN SOLUTION FOR THERMAL IMPRINTING, INJECTION MOLDED BODY FOR THERMAL IMPRINTING, THIN FILM FOR THERMAL IMPRINTING, AND PROCESS FOR PRODUCING THE THIN FILM
    2.
    发明公开
    RESIN FOR THERMAL IMPRINTING, RESIN SOLUTION FOR THERMAL IMPRINTING, INJECTION MOLDED BODY FOR THERMAL IMPRINTING, THIN FILM FOR THERMAL IMPRINTING, AND PROCESS FOR PRODUCING THE THIN FILM 审中-公开
    树脂对热压印，树脂溶液用于热压花加工模具元在热轧压花，一层薄膜，以热压花及其制造方法薄膜

    公开(公告)号：EP2163565A4

    公开(公告)日：2010-10-27

    申请号：EP08790131

    申请日：2008-07-02

    申请人： MARUZEN PETROCHEM CO LTD ,  SCIVAX CORP

    发明人： SATSUKA TAKURO ,  TAKAYA YOSHIAKI ,  KUSUURA TAKAHISA ,  MITRA ANUPAM

    IPC分类号： C08F32/08 ,  B05D1/40 ,  B29C45/00 ,  B29C59/02

    CPC分类号： C08F32/08

    摘要： There are provided a thermal-imprinting resin which has a good heat-deterioration tolerability and a low resin elastic modulus at the time of fluidization in order to suppress any production of particle-like materials in microfabrication by thermal imprinting, and has a good fine-pattern transfer characteristic, a thermal-imprinting-resin solution using the same, a thermal-imprinting injection-molded body using the same, a thermal-imprinting thin film using the same and a production method thereof. The thermal-imprinting resin has an exothermic onset temperature (oxidation onset temperature) of an exothermic peak due to oxidation greater than or equal to + 35 °C to the glass transition temperature of the resin in differential scanning calorimetric measurement at a temperature rise rate of 5 °C/min in air, and has a complex modulus less than 0.24 MPa at the glass transition temperature of the resin + 35 °C in a dynamic viscoelastic modulus measurement at a frequency of 1 rad/sec in nitrogen stream. The thermal-imprinting-resin solution, the thermal-imprinting injection-molded body, the thermal-imprinting thin film and the production method thereof use the foregoing resin.