利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.011 秒)

    RESIN FOR THERMAL IMPRINTING, RESIN SOLUTION FOR THERMAL IMPRINTING, INJECTION MOLDED BODY FOR THERMAL IMPRINTING, THIN FILM FOR THERMAL IMPRINTING, AND PROCESS FOR PRODUCING THE THIN FILM
    2.
    发明公开
    RESIN FOR THERMAL IMPRINTING, RESIN SOLUTION FOR THERMAL IMPRINTING, INJECTION MOLDED BODY FOR THERMAL IMPRINTING, THIN FILM FOR THERMAL IMPRINTING, AND PROCESS FOR PRODUCING THE THIN FILM 审中-公开
    树脂对热压印，树脂溶液用于热压花加工模具元在热轧压花，一层薄膜，以热压花及其制造方法薄膜

    公开(公告)号：EP2163565A4

    公开(公告)日：2010-10-27

    申请号：EP08790131

    申请日：2008-07-02

    申请人： MARUZEN PETROCHEM CO LTD ,  SCIVAX CORP

    发明人： SATSUKA TAKURO ,  TAKAYA YOSHIAKI ,  KUSUURA TAKAHISA ,  MITRA ANUPAM

    IPC分类号： C08F32/08 ,  B05D1/40 ,  B29C45/00 ,  B29C59/02

    CPC分类号： C08F32/08

    摘要： There are provided a thermal-imprinting resin which has a good heat-deterioration tolerability and a low resin elastic modulus at the time of fluidization in order to suppress any production of particle-like materials in microfabrication by thermal imprinting, and has a good fine-pattern transfer characteristic, a thermal-imprinting-resin solution using the same, a thermal-imprinting injection-molded body using the same, a thermal-imprinting thin film using the same and a production method thereof. The thermal-imprinting resin has an exothermic onset temperature (oxidation onset temperature) of an exothermic peak due to oxidation greater than or equal to + 35 °C to the glass transition temperature of the resin in differential scanning calorimetric measurement at a temperature rise rate of 5 °C/min in air, and has a complex modulus less than 0.24 MPa at the glass transition temperature of the resin + 35 °C in a dynamic viscoelastic modulus measurement at a frequency of 1 rad/sec in nitrogen stream. The thermal-imprinting-resin solution, the thermal-imprinting injection-molded body, the thermal-imprinting thin film and the production method thereof use the foregoing resin.

    ETCHING MASK, BASE MATERIAL HAVING ETCHING MASK, FINELY PROCESSED ARTICLE, AND METHOD FOR PRODUCTION OF FINELY PROCESSED ARTICLE
    5.
    发明公开
    ETCHING MASK, BASE MATERIAL HAVING ETCHING MASK, FINELY PROCESSED ARTICLE, AND METHOD FOR PRODUCTION OF FINELY PROCESSED ARTICLE 审中-公开
    蚀刻掩模，WITH蚀刻掩模，FINE加工制品并产生精细加工制品方法基本物质

    公开(公告)号：EP2221162A4

    公开(公告)日：2011-12-28

    申请号：EP08848634

    申请日：2008-11-13

    申请人： MARUZEN PETROCHEM CO LTD

    发明人： TAKAYA YOSHIAKI ,  SATSUKA TAKURO ,  HAYASHIDA YOSHIHISA ,  KUSUURA TAKAHISA ,  MITRA ANUPAM

    IPC分类号： G03F7/00 ,  B29C59/02 ,  C08L45/00 ,  C08L65/00 ,  H01L21/027

    CPC分类号： C08G61/08 ,  B82Y10/00 ,  B82Y40/00 ,  C09D145/00 ,  G03F7/0002 ,  G03F7/11 ,  H01L21/0271

    摘要： There are provided an etching mask which has a superior thermal imprinting characteristic and also a good anti-etching characteristic, a base material with the etching mask, a microfabricated product to which those etching mask and base material are applied, and a production method of the microfabricated product. The etching mask formed of a thermoplastic resin containing at least one kind of skeleton expressed by a chemical formula (1) or a chemical formula (2) in a main chain (R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 in the formulae (1), (2) can be different or same one another, each of which is a hydrogen atom, a deuterium atom, a hydrocarbon group having a carbon number of 1 to 15, a halogen atom, or a substituent group containing a hetero atom like oxygen or sulfur, and may form a ring structure one another. m and n are integers equal to or greater than 0).

    摘要翻译： 有在蚀刻掩模具有优良的热压印特征，因此提供了良好的抗腐蚀特性，基底材料与蚀刻掩模，微制造产品到那些蚀刻掩模和基体材料是哪个应用，并且所述制造方法 微制造的产品。 蚀刻掩模形成包含至少一种骨架的由化学式（1）或化学式（2）在主链（R 1过表达时，R 2，R 3，R 4的热塑性树脂的，R 5， R 6，R 7，R 8中的式（1），（2）可以是不同的或相同的彼此，其每一个为氢原子，氘原子，具有1至15个碳数的烃基， 卤素原子，或含有如氧或硫的杂原子的取代基，并且可以形成环结构彼此连接。m和n是等于或大于0）的整数。