公开(公告)号：EP2581954A4

公开(公告)日：2014-07-30

申请号：EP11792439

申请日：2011-06-07

申请人： SEKISUI CHEMICAL CO LTD

发明人： NISHIMURA TAKASHI ,  WATANABE TAKASHI

IPC分类号： H01L33/48 ,  C08K3/26 ,  C08L83/05 ,  C08L83/07 ,  C09J183/04 ,  H01L21/52

CPC分类号： H01L33/641 ,  C08G77/12 ,  C08G77/20 ,  C08K3/26 ,  C08K3/38 ,  C08K2003/267 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO 3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.