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1.发明公开
公开(公告)号：EP3222692A4
公开(公告)日：2018-07-04
申请号：EP15860929
申请日：2015-09-18
发明人： TANIKAWA MITSURU , WATANABE TAKASHI , FUJITA YUSUKE , FUJITA YOSHITO , UEDA MICHIHISA , INUI OSAMU , TAKAHASHI RYOSUKE , INOUE TAKANORI
IPC分类号： C09J201/00 , C09J4/02 , C09J5/06 , C09J11/06 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： C09J133/14 , C09J4/00 , C09J5/06 , C09J11/06 , C09J133/06 , C09J163/00 , C09J201/00 , C09J201/08 , C09J2203/326 , C09J2205/31 , H01L21/52 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/75 , H01L24/83 , H01L25/065 , H01L25/07 , H01L25/18 , H01L2224/27312 , H01L2224/27318 , H01L2224/278 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/75155 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/94 , H01L2924/0002 , H01L2924/00014 , H01L2924/00 , C08F220/18 , H01L2924/00012 , H01L2224/27 , H01L2224/83
摘要： Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive layer to hardly generate voids. A photocurable and thermosetting adhesive for inkjet according to the present invention contains a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermal curing agent, wherein the elastic modulus at 25°C of a B-staged adhesive is at least 5.0 × 10 2 Pa and at most 8.0 0 × 10 4 Pa when the B-staged adhesive is obtained by irradiating the adhesive with light of a cumulative light quantity of 1000 mJ/cm 2 so that illumination at a wavelength of 365 nm is 100 mW/cm 2 .
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公开(公告)号：EP3202501A4
公开(公告)日：2018-06-27
申请号：EP15846681
申请日：2015-09-18
发明人： UEDA MICHIHISA , HONDA MASUMI , MORIMOTO NAOYUKI , INOUE TAKANORI , WATANABE TAKASHI , HAMADA TAICHI , TAKAHASHI RYOSUKE
IPC分类号： B05C5/00 , B05C11/10 , B41J2/01 , B41J2/175 , C08G59/42 , C08L63/00 , H01L21/027 , H01L21/67 , H01L23/00 , H05K3/00 , H05K3/28
CPC分类号： B05C5/001 , B05C5/0204 , B05C11/1039 , B05C11/1042 , B41J2/175 , B41J2/17513 , C08G59/4215 , C08L63/00 , H01L21/6715 , H01L24/27 , H01L24/29 , H01L24/743 , H01L2224/27312 , H01L2224/2919 , H01L2224/83191 , H01L2224/83862 , H01L2224/83874 , H05K3/0091 , H05K3/285 , H05K2203/0759 , Y02P20/123 , H01L2924/0665 , H01L2924/0635
摘要： There is provided a liquid ejection device capable of applying a high quality curable composition stably and efficiently by heating the curable composition to a temperature at which the curable composition can be ejected from a head, in a short time without heating the curable composition rapidly and excessively. This liquid ejection device (1) is provided with: a first tank (2) for retaining a liquid composition; a head (3) for ejecting the liquid composition; a first heating means (4) for heating the liquid composition within the first tank (2); a first channel (5) for supplying the liquid composition from the first tank (2) to the head (3); a second heating means (6) for heating the liquid composition passing through the first channel (5) at a heating temperature higher than that of the first heating means (4); a second channel (7) for returning the liquid composition from the head (3) to the first tank (2) ; a second pump (8) that is provided on the first channel (5) ; and a first pump (9) that is provided on the second channel (7), wherein the temperature difference between the heating temperature of the second heating means (6) and the heating temperature of the first heating means (4) is 65°C or less.
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3.发明公开
公开(公告)号：EP3249022A4
公开(公告)日：2018-06-20
申请号：EP16740213
申请日：2016-01-20
IPC分类号： C09J4/02 , C09J5/06 , C09J11/06 , C09J163/00 , H01L21/52
CPC分类号： C09D133/14 , C08G59/4215 , C08G59/5033 , C08G59/686 , C08L33/08 , C09D11/101 , C09D11/107 , C09D11/30 , C09D11/52 , C09D133/10 , C09J5/04 , C09J5/06 , C09J9/02 , C09J133/10 , C09J133/14 , C09J163/00 , C09J171/12 , C09J201/02 , C09J2203/326 , C09J2205/114 , C09J2205/31 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/52 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/2741 , H01L2224/2783 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83026 , H01L2224/8322 , H01L2224/83359 , H01L2224/83862 , H01L2224/83947 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , C08L33/04
摘要： Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.
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4.发明公开METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT 有权VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN KOMPONENTE UND ELEKTRONISCHE KOMPONENTE
公开(公告)号：EP3073520A4
公开(公告)日：2017-09-20
申请号：EP14863263
申请日：2014-11-18
发明人： TANIKAWA MITSURU , WATANABE TAKASHI , UEDA MICHIHISA , NAKAMURA SHIGERU , MAENAKA HIROSHI , TAKAHASHI RYOSUKE , INOUE TAKANORI , FUJITA YOSHITO
CPC分类号： H01L21/02288 , C08F220/10 , C09J4/00 , C09J5/00 , C09J2205/31 , H01L21/52 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/27318 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2224/83862 , H01L2224/83874 , H01L2224/83885 , H01L2224/8592 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy. The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.
摘要翻译： 本发明提供一种电子部件的制造方法，其能够以高精度容易地形成固化粘合剂层。 本发明的固化性膜电子部件的制造方法包括：使用喷墨装置在第一电子部件主体上涂布粘接剂而形成粘接层的涂敷工序;第一光照射工序，在该第一光照射工序中， 使用来自第一光照射部的光照射层，在照射光的粘接层上配置第二电子部件主体并进行贴附的贴装工序和通过加热使粘接层固化的工序，从而得到 所述喷墨装置包括用于存储所述粘合剂的墨罐，排出部和循环流路部，并且在所述涂布步骤中，所述粘合剂在所述喷墨装置中循环的同时施加。
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5.发明公开DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICES AND OPTICAL SEMICONDUCTOR DEVICE USING SAME 审中-公开CHIP物质含有的光半导体器件和光半导体组件
公开(公告)号：EP2581954A4
公开(公告)日：2014-07-30
申请号：EP11792439
申请日：2011-06-07
CPC分类号： H01L33/641 , C08G77/12 , C08G77/20 , C08K3/26 , C08K3/38 , C08K2003/267 , C08L83/00 , C08L83/04 , C09J183/04 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO 3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.
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6.发明公开CURABLE COMPOSITION FOR INKJET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT 有权用于喷墨打印的可硬化组合物和生产电子组件的方法
公开(公告)号：EP2620478A4
公开(公告)日：2014-03-26
申请号：EP11826817
申请日：2011-09-20
IPC分类号： C09D11/00 , B41J2/01 , B41M5/00 , C08G59/44 , C08G59/50 , C09D11/10 , C09D11/38 , H05K3/06 , H05K3/10 , H05K3/28
CPC分类号： C09D163/00 , B41M3/006 , C08G59/4021 , C08L63/00 , C09D11/101 , C09D11/30 , H01L31/0516 , H05K3/285 , H05K2203/013 , Y02E10/50
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公开(公告)号：EP3214142A4
公开(公告)日：2018-04-18
申请号：EP16749313
申请日：2016-02-12
发明人： TANIKAWA MITSURU , TAKAHASHI RYOSUKE , INOUE TAKANORI , UEDA MICHIHISA , YAMADA TASUKU , FUJITA YOSHITO , WATANABE TAKASHI , FUJITA YUSUKE
IPC分类号： C09D11/30 , B41M5/00 , C07D231/12 , C07D249/04 , C07D249/08 , C09D11/101 , C09D11/36 , C09D11/38 , H05K3/28
CPC分类号： C07C211/51 , C07D231/12 , C07D249/04 , C07D249/08 , C09D11/101 , C09D11/36 , C09D11/38 , H05K3/28
摘要： Provided is a curable composition for inkjet which can have a prolonged pot life even under an environment in an inkjet device that is warmed to 50°C or higher and which can be cured into a cured product having improved heat resistance and insulation reliability, in spite of the fact that a thermally curable compound is used in the curable composition. The curable composition for inkjet according to the present invention contains a photocurable compound, a thermally curable compound, a photopolymerization initiator and a thermal curing agent and does not contain a solvent or contains the solvent, wherein the content of the solvent in 100% by weight of the curable composition is 1% by weight or less when the curable composition for inkjet contains the solvent, the photocurable compound contains a polyfunctional compound having at least two (meth)acryloyl groups, and the thermal curing agent is an aromatic amine having at least one benzene ring and at least two amino groups.
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8.发明公开SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICES, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开密封剂的光半导体装置及光学半导体部件
公开(公告)号：EP2733178A4
公开(公告)日：2015-03-04
申请号：EP12810683
申请日：2012-07-11
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9.发明公开ENCAPSULANT FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING SAME 有权密封剂的光半导体装置及光学半导体部件THAT
公开(公告)号：EP2586832A4
公开(公告)日：2014-02-19
申请号：EP11798176
申请日：2011-06-22
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10.发明公开
公开(公告)号：EP3249024A4
公开(公告)日：2018-06-20
申请号：EP16740212
申请日：2016-01-20
IPC分类号： C09J201/02 , C08G59/50 , C09J4/02 , C09J5/06 , C09J11/06 , C09J163/00 , H01L21/52
CPC分类号： C09D133/14 , C08G59/4215 , C08G59/5033 , C08G59/686 , C08L33/08 , C09D11/101 , C09D11/107 , C09D11/30 , C09D11/52 , C09D133/10 , C09J5/04 , C09J5/06 , C09J9/02 , C09J133/10 , C09J133/14 , C09J163/00 , C09J171/12 , C09J201/02 , C09J2203/326 , C09J2205/114 , C09J2205/31 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/52 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/2741 , H01L2224/2783 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83026 , H01L2224/8322 , H01L2224/83359 , H01L2224/83862 , H01L2224/83947 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , C08L33/04
摘要： Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.
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