公开(公告)号：EP3200246A1

公开(公告)日：2017-08-02

申请号：EP17162555.1

申请日：2006-08-17

申请人： Seoul Semiconductor Co., Ltd.

发明人： Choi, Hyuck Jung ,  Kim, Won Il ,  Lee, Sang Min

IPC分类号： H01L33/00 ,  B29C45/14 ,  B29C45/16 ,  B29C45/27

CPC分类号： B29C45/27 ,  B29C45/0055 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/2712 ,  B29K2995/0025 ,  B29K2995/0026 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.

摘要翻译： 公开了一种发光二极管的制造方法。 制造方法包括准备衬底和在衬底上安装发光芯片的步骤。 中间板位于基板上。 中间板具有用于容纳发光芯片的通孔和用于在其上表面上彼此连接通孔的槽。 通过使用沟槽作为浇道来利用透明模制材料执行传递模制工艺以形成填充通孔的第一模制部分。 此后，去除中间板，并将衬底分成单独的发光二极管。 因此，可以提供一种发光二极管，其中通过传递模塑工艺形成的第一模塑部分位于由基材的切割表面包围的区域内。 由于第一模制部分位于由基板的切割表面包围的区域内，所以第二模制部分可以以各种方式对称地形成在第一模制部分的侧表面上。

公开(公告)号：EP2284913B1

公开(公告)日：2016-11-30

申请号：EP10190796.2

申请日：2006-08-17

申请人： SEOUL SEMICONDUCTOR CO., LTD.

发明人： Lee, Sang Min ,  Choi, Hyuck Jung ,  Kim, Won Il

IPC分类号： H01L33/00 ,  B29C45/14 ,  B29C45/16 ,  B29C45/27

CPC分类号： B29C45/27 ,  B29C45/0055 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/2712 ,  B29K2995/0025 ,  B29K2995/0026 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2284913A3

公开(公告)日：2012-10-17

申请号：EP10190796.2

申请日：2006-08-17

申请人： SEOUL SEMICONDUCTOR CO., LTD.

发明人： Lee, Sang Min ,  Choi, Hyuck Jung ,  Kim, Won Il

IPC分类号： H01L33/00 ,  B29C45/14 ,  B29C45/16 ,  B29C45/27

CPC分类号： B29C45/27 ,  B29C45/0055 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/2712 ,  B29K2995/0025 ,  B29K2995/0026 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.

公开(公告)号：EP2284913A2

公开(公告)日：2011-02-16

申请号：EP10190796.2

申请日：2006-08-17

申请人： SEOUL SEMICONDUCTOR CO., LTD.

发明人： Lee, Sang Min ,  Choi, Hyuck Jung ,  Kim, Won Il

IPC分类号： H01L33/00

CPC分类号： B29C45/27 ,  B29C45/0055 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/2712 ,  B29K2995/0025 ,  B29K2995/0026 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.

摘要翻译： 公开了一种发光二极管的制造方法。 该制造方法包括准备基板并将发光芯片安装在基板上的步骤。 中间板位于基板上。 中间板具有用于接收发光芯片的通孔和用于在其上表面上将通孔彼此连接的凹槽。 通过使用沟槽作为流道，通过透明模塑材料进行传递模塑工艺以形成填充通孔的第一模塑部分。 此后，中间板被去除，并且基板被分离成单独的发光二极管。 因此，可以提供一种发光二极管，其中通过传递模塑工艺形成的第一模塑部分位于由衬底的切割表面包围的区域内。 由于第一成型部分位于由基板的切割面所包围的区域内，所以第二成型部分可以以各种方式对称地形成在第一成型部分的侧表面上。