利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

9 条记录 (耗时 0.014 秒)

    MANUFACTURING METHOD OF LIGHT EMITTING DIODE
    2.
    发明公开
    MANUFACTURING METHOD OF LIGHT EMITTING DIODE 审中-公开
    发光二极管的制造方法

    公开(公告)号：EP3200246A1

    公开(公告)日：2017-08-02

    申请号：EP17162555.1

    申请日：2006-08-17

    申请人： Seoul Semiconductor Co., Ltd.

    发明人： Choi, Hyuck Jung ,  Kim, Won Il ,  Lee, Sang Min

    IPC分类号： H01L33/00 ,  B29C45/14 ,  B29C45/16 ,  B29C45/27

    CPC分类号： B29C45/27 ,  B29C45/0055 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/2712 ,  B29K2995/0025 ,  B29K2995/0026 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.

    摘要翻译： 公开了一种发光二极管的制造方法。 制造方法包括准备衬底和在衬底上安装发光芯片的步骤。 中间板位于基板上。 中间板具有用于容纳发光芯片的通孔和用于在其上表面上彼此连接通孔的槽。 通过使用沟槽作为浇道来利用透明模制材料执行传递模制工艺以形成填充通孔的第一模制部分。 此后，去除中间板，并将衬底分成单独的发光二极管。 因此，可以提供一种发光二极管，其中通过传递模塑工艺形成的第一模塑部分位于由基材的切割表面包围的区域内。 由于第一模制部分位于由基板的切割表面包围的区域内，所以第二模制部分可以以各种方式对称地形成在第一模制部分的侧表面上。

    Light emitting device and method of fabricating the same
    4.
    发明公开
    Light emitting device and method of fabricating the same 审中-公开
    发光装置及其制造方法

    公开(公告)号：EP2819187A1

    公开(公告)日：2014-12-31

    申请号：EP14174867.3

    申请日：2014-06-29

    申请人： Seoul Semiconductor Co., Ltd.

    发明人： Choi, Hyuck Jung ,  Kim, Dae Hee

    IPC分类号： H01L33/50 ,  H01L33/56

    CPC分类号： H01L33/005 ,  H01L22/12 ,  H01L33/504 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H05B33/10 ,  H05B33/12

    摘要： Embodiments of the invention provide a light emitting device enabling correction of color coordinates into a desired target bin, and a method of fabricating the same. The method includes forming a first resin containing phosphors inside a cavity of a package body on which a light emitting diode chip is mounted, measuring color coordinates of light emitted by combination of the light emitting diode chip and the first resin, and correcting the color coordinates by forming a second resin on the first resin, thereby improving yield of light emitting devices.

    摘要翻译： 本发明的实施例提供了一种能够将色坐标校正为期望的目标箱的发光设备及其制造方法。 该方法包括：在安装有发光二极管芯片的封装体的空腔内形成含有荧光体的第一树脂，测量由发光二极管芯片和第一树脂的组合发射的光的颜色坐标，以及校正颜色坐标 通过在第一树脂上形成第二树脂，从而提高发光器件的产量。

    LED package having an array of light emitting cells coupled in series
    5.
    发明公开
    LED package having an array of light emitting cells coupled in series 有权
    LED-Kapselung mit einer Gruppe在Reihe geschalteter Leuchtzellen

    公开(公告)号：EP2280430A2

    公开(公告)日：2011-02-02

    申请号：EP10191192.3

    申请日：2005-10-26

    申请人： Seoul Semiconductor Co., Ltd.

    发明人： Lee, Chung Hoon ,  Lee, Keon Young ,  Kim, Hong San ,  Kim, Dae Won ,  Choi, Hyuck Jung

    IPC分类号： H01L33/00 ,  H01L27/15

    摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

    摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括封装主体和安装在封装主体上的LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

    Manufacturing method of light emitting diode
    9.
    发明公开
    Manufacturing method of light emitting diode 有权
    Verfahren zur Herstellung einer lichtemittierenden Diode

    公开(公告)号：EP2284913A2

    公开(公告)日：2011-02-16

    申请号：EP10190796.2

    申请日：2006-08-17

    申请人： SEOUL SEMICONDUCTOR CO., LTD.

    发明人： Lee, Sang Min ,  Choi, Hyuck Jung ,  Kim, Won Il

    IPC分类号： H01L33/00

    CPC分类号： B29C45/27 ,  B29C45/0055 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/2712 ,  B29K2995/0025 ,  B29K2995/0026 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.

    摘要翻译： 公开了一种发光二极管的制造方法。 该制造方法包括准备基板并将发光芯片安装在基板上的步骤。 中间板位于基板上。 中间板具有用于接收发光芯片的通孔和用于在其上表面上将通孔彼此连接的凹槽。 通过使用沟槽作为流道，通过透明模塑材料进行传递模塑工艺以形成填充通孔的第一模塑部分。 此后，中间板被去除，并且基板被分离成单独的发光二极管。 因此，可以提供一种发光二极管，其中通过传递模塑工艺形成的第一模塑部分位于由衬底的切割表面包围的区域内。 由于第一成型部分位于由基板的切割面所包围的区域内，所以第二成型部分可以以各种方式对称地形成在第一成型部分的侧表面上。