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公开(公告)号：EP0525282A3
公开(公告)日：1994-01-19
申请号：EP92102667.0
申请日：1992-02-18
Applicant: SHIPLEY COMPANY INC.
Inventor： Sricharoenchaikit, Prasit , Calabrese, Gary S. , Gulla, Michael
CPC classification number: C23C18/52
Abstract: A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Abstract translation: 用于以精细尺寸的选择性图案化学沉积薄金属涂层的组合物。 本发明的无电镀溶液的特征在于金属含量低，优选不含碱金属或碱土金属离子。
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公开(公告)号：EP0525282A2
公开(公告)日：1993-02-03
申请号：EP92102667.0
申请日：1992-02-18
Applicant: SHIPLEY COMPANY INC.
Inventor： Sricharoenchaikit, Prasit , Calabrese, Gary S. , Gulla, Michael
CPC classification number: C23C18/52
Abstract: A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Abstract translation: 用于以优选尺寸的选择性图案无电沉积薄金属涂层的组合物。 本发明的化学镀溶液的特征在于金属含量低，优选不含碱金属或碱土金属离子。
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