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公开(公告)号：EP0397988B1
公开(公告)日：1997-11-26
申请号：EP90105228.2
申请日：1990-03-20
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Sricharoenchaikit, Prasit
IPC: G03F7/40
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公开(公告)号：EP0525282A3
公开(公告)日：1994-01-19
申请号：EP92102667.0
申请日：1992-02-18
Applicant: SHIPLEY COMPANY INC.
Inventor： Sricharoenchaikit, Prasit , Calabrese, Gary S. , Gulla, Michael
CPC classification number: C23C18/52
Abstract: A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Abstract translation: 用于以精细尺寸的选择性图案化学沉积薄金属涂层的组合物。 本发明的无电镀溶液的特征在于金属含量低，优选不含碱金属或碱土金属离子。
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公开(公告)号：EP0397988A3
公开(公告)日：1991-10-09
申请号：EP90105228.2
申请日：1990-03-20
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Sricharoenchaikit, Prasit
IPC: G03F7/40
Abstract: This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaning photoresist coating unprotected by the metal mask.
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公开(公告)号：EP0320601A3
公开(公告)日：1990-04-25
申请号：EP88117392.6
申请日：1988-10-19
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Foust, Donald F. , Philipose, George K.
IPC: C25D5/54
CPC classification number: C25D5/54 , H05K3/188 , H05K3/424 , H05K3/427 , H05K2203/0716 , Y10S205/92
Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
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公开(公告)号：EP0163831A2
公开(公告)日：1985-12-11
申请号：EP85103389.4
申请日：1985-03-22
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Dutkewych, Oleh Borys , Bladon, John James
IPC: C23C18/30
CPC classification number: C23C18/30
Abstract: A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
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Patent Agency Ranking
公开(公告)号：EP0483484A3
公开(公告)日：1993-01-20
申请号：EP91114755.1
申请日：1991-09-02
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Sricharoenchaikit, Prasit
CPC classification number: G03F7/2022 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/184 , H05K2203/0505 , H05K2203/0706 , H05K2203/1415
Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst (16) over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal (18) over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.
Abstract translation: 一种用于选择性金属化的方法，包括以下步骤：提供涂覆有光致抗蚀剂的基底，通过暴露于图案辐射和显影，对光致抗蚀剂涂层进行曝光，将光致抗蚀剂涂层暴露于激活辐射，在整个成像的光致抗蚀剂涂层上沉积化学镀催化剂， 裸露的下面的衬底，通过显影去除暴露的暴露的催化的光致抗蚀剂涂层的顶表面，由此镀催化剂保持在所需的选择性图案中并且在催化表面上沉积金属以形成诸如电路图案的选择性图案的金属沉积物。 该方法适用于制造包括印刷电路板在内的多种制品。
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公开(公告)号：EP0320601A2
公开(公告)日：1989-06-21
申请号：EP88117392.6
申请日：1988-10-19
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Foust, Donald F. , Philipose, George K.
IPC: C25D5/54
CPC classification number: C25D5/54 , H05K3/188 , H05K3/424 , H05K3/427 , H05K2203/0716 , Y10S205/92
Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
Abstract translation: 由有机塑料形成的制品的表面进行金属电镀的方法。 该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。 其中一个电极是待镀的制品，并且具有与导电区域相邻并与其接触的过渡金属硫化物区域的表面。 该方法对印刷电路板的形成特别有用，并且通过涉及图案电镀的工艺能够形成印刷电路板是足够通用的。
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公开(公告)号：EP0163831A3
公开(公告)日：1987-08-26
申请号：EP85103389
申请日：1985-03-22
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Dutkewych, Oleh Borys , Bladon, John James
IPC: C23C18/30
CPC classification number: C23C18/30
Abstract: A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
Abstract translation: 悬浮在含有还原的催化金属的有机悬浮剂中的水溶液中的催化吸附物，其中还原的催化金属的最大尺寸不超过500埃。 催化吸附物可用于无电金属沉积的非催化基材的无电金属沉积。
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公开(公告)号：EP0483484A2
公开(公告)日：1992-05-06
申请号：EP91114755.1
申请日：1991-09-02
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Sricharoenchaikit, Prasit
CPC classification number: G03F7/2022 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , H05K3/184 , H05K2203/0505 , H05K2203/0706 , H05K2203/1415
Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst (16) over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal (18) over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.
Abstract translation: 一种用于选择性金属化的方法，包括以下步骤：提供涂覆有光致抗蚀剂的基底，通过暴露于图案辐射和显影，对光致抗蚀剂涂层进行曝光，将光致抗蚀剂涂层暴露于激活辐射，在整个成像的光致抗蚀剂涂层上沉积化学镀催化剂， 裸露的下面的衬底，通过显影去除暴露的暴露的催化的光致抗蚀剂涂层的顶表面，由此镀催化剂保持在所需的选择性图案中并且在催化表面上沉积金属以形成诸如电路图案的选择性图案的金属沉积物。 该方法适用于制造包括印刷电路板在内的多种制品。
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公开(公告)号：EP0525282A2
公开(公告)日：1993-02-03
申请号：EP92102667.0
申请日：1992-02-18
Applicant: SHIPLEY COMPANY INC.
Inventor： Sricharoenchaikit, Prasit , Calabrese, Gary S. , Gulla, Michael
CPC classification number: C23C18/52
Abstract: A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Abstract translation: 用于以优选尺寸的选择性图案无电沉积薄金属涂层的组合物。 本发明的化学镀溶液的特征在于金属含量低，优选不含碱金属或碱土金属离子。
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