公开(公告)号：EP0440027A3

公开(公告)日：1991-11-06

申请号：EP91100240.0

申请日：1991-01-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Bernards, Roger F. ,  Fisher, Gordon ,  Sonnenberg, Wade ,  Cerwonka, Edward J. ,  Fisher, Stewart

IPC: C25D3/38

CPC classification number: H05K3/42 ,  C25D3/38 ,  H05K3/423 ,  H05K2203/162

Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.

公开(公告)号：EP0242530A3

公开(公告)日：1989-05-10

申请号：EP87102422.0

申请日：1987-02-20

Applicant: SHIPLEY COMPANY INC.

Inventor： Fisher, Gordon

IPC: G01N27/42 ,  C25D21/12

CPC classification number: G01N27/423 ,  H05K3/241 ,  H05K3/423

Abstract: A method for determining the effective quantity of an organic additive in an electroplating bath involving passing an inert electrode through a predetermined sequence of voltammetric steps including a step of plating the electrode at a given applied potential, stripping the plated metal at a given applied potential, and conditioning the inert electrode without applied potential; correlating the quantity of additive with the coulombs utilized during the metal stripping step; and using the same predetermined sequence of voltammetric steps for a bath having an unknown quantity of additive.

公开(公告)号：EP0242530B1

公开(公告)日：1992-04-22

申请号：EP87102422.0

申请日：1987-02-20

Applicant: SHIPLEY COMPANY INC.

Inventor： Fisher, Gordon

IPC: G01N27/42 ,  C25D21/12

CPC classification number: G01N27/423 ,  H05K3/241 ,  H05K3/423

公开(公告)号：EP0440027A2

公开(公告)日：1991-08-07

申请号：EP91100240.0

申请日：1991-01-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Bernards, Roger F. ,  Fisher, Gordon ,  Sonnenberg, Wade ,  Cerwonka, Edward J. ,  Fisher, Stewart

IPC: C25D3/38

CPC classification number: H05K3/42 ,  C25D3/38 ,  H05K3/423 ,  H05K2203/162

Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.

Abstract translation: 本发明公开了一种用于酸性电镀浴的添加剂的使用，其基于产生电镀液的电荷转移超电势的偏移的标准来选择; 或者替代地，在高宽比电路板的表面和这种板的凹部之间产生差分超电势。 添加剂可以是单组分或多组分添加剂。

公开(公告)号：EP0242530A2

公开(公告)日：1987-10-28

申请号：EP87102422.0

申请日：1987-02-20

Applicant: SHIPLEY COMPANY INC.

Inventor： Fisher, Gordon

IPC: G01N27/42 ,  C25D21/12

CPC classification number: G01N27/423 ,  H05K3/241 ,  H05K3/423

Abstract: A method for determining the effective quantity of an organic additive in an electroplating bath involving passing an inert electrode through a predetermined sequence of voltammetric steps including a step of plating the electrode at a given applied potential, stripping the plated metal at a given applied potential, and conditioning the inert electrode without applied potential; correlating the quantity of additive with the coulombs utilized during the metal stripping step; and using the same predetermined sequence of voltammetric steps for a bath having an unknown quantity of additive.

Abstract translation: 一种用于确定电镀浴中有机添加剂的有效量的方法，包括使惰性电极通过预定的伏安步骤顺序，包括在给定的施加电位下电镀电极的步骤，在给定的施加电位下汽提镀覆的金属， 并调节惰性电极而不施加电位; 将添加剂的量与在金属汽提步骤期间使用的库仑相关联; 并且对于具有未知量的添加剂的浴使用相同的伏安法步骤。