公开(公告)号：EP0427923A3

公开(公告)日：1991-11-06

申请号：EP90115155.5

申请日：1990-08-07

Applicant: SHIPLEY COMPANY INC.

Inventor： Ho, Ivan ,  Harris, Martin J. ,  Harrison, Richard ,  Miller, Phillip J. Jr

IPC: G03F7/16

CPC classification number: G03F7/164 ,  H05K3/0079 ,  H05K3/0091 ,  H05K2203/0292 ,  H05K2203/135 ,  H05K2203/1518

Abstract: A process for applying a pinhole free organic coating on a conductive substrate during an electrodeposition process. The elimination of pinhole defects is accomplished by use of a vibrating device interfaced with the equipment which dislodges gas bubbles adhering to the surface of the substrate during the electrodeposition process.

公开(公告)号：EP0427923A2

公开(公告)日：1991-05-22

申请号：EP90115155.5

申请日：1990-08-07

Applicant: SHIPLEY COMPANY INC.

Inventor： Ho, Ivan ,  Harris, Martin J. ,  Harrison, Richard ,  Miller, Phillip J. Jr

IPC: G03F7/16

CPC classification number: G03F7/164 ,  H05K3/0079 ,  H05K3/0091 ,  H05K2203/0292 ,  H05K2203/135 ,  H05K2203/1518

Abstract: A process for applying a pinhole free organic coating on a conductive substrate during an electrodeposition process. The elimination of pinhole defects is accomplished by use of a vibrating device interfaced with the equipment which dislodges gas bubbles adhering to the surface of the substrate during the electrodeposition process.

Abstract translation: 在电沉积过程中在导电基材上施加无针孔有机涂层的方法。 消除针孔缺陷是通过使用与设备接口的振动装置来完成的，该设备在电沉积过程中除去附着在基板表面上的气泡。