公开(公告)号：EP0524422A3

公开(公告)日：1994-04-13

申请号：EP92110053.3

申请日：1992-06-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R. ,  Staniunas, Richard

IPC: C23C18/48 ,  C23C18/52

CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

Abstract translation: 一种提高锡铅合金沉积物的回流能力并增加其对下面基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该工艺在制造印刷电路板时非常有用。

公开(公告)号：EP0524422A2

公开(公告)日：1993-01-27

申请号：EP92110053.3

申请日：1992-06-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R. ,  Staniunas, Richard

IPC: C23C18/48 ,  C23C18/52

CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

Abstract translation: 一种用于增加锡铅合金沉积物的回流能力并增加其对下面的基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该方法在印刷电路板的制造中是有用的。