公开(公告)号：EP0524422A3

公开(公告)日：1994-04-13

申请号：EP92110053.3

申请日：1992-06-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R. ,  Staniunas, Richard

IPC: C23C18/48 ,  C23C18/52

CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

Abstract translation: 一种提高锡铅合金沉积物的回流能力并增加其对下面基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该工艺在制造印刷电路板时非常有用。

公开(公告)号：EP0565858B1

公开(公告)日：1999-09-01

申请号：EP93103750.1

申请日：1993-03-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Knudsen, Philip D. ,  Shipley, Charles R. ,  Pai, Daniel Y.

IPC: G03F7/033

CPC classification number: G03F7/038 ,  G03F7/0045 ,  H05K3/287 ,  Y02P20/582 ,  Y10T428/24917

公开(公告)号：EP0565858A1

公开(公告)日：1993-10-20

申请号：EP93103750.1

申请日：1993-03-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Knudsen, Philip D. ,  Shipley, Charles R. ,  Pai, Daniel Y.

IPC: G03F7/033

CPC classification number: G03F7/038 ,  G03F7/0045 ,  H05K3/287 ,  Y02P20/582 ,  Y10T428/24917

Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions off the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Abstract translation: 辐射敏感组合物，使用组合物的方法和包含该组合物的制品。 本发明的可光成像组合物包含辐射敏感组分，树脂粘合剂和包含一个或多个内部环氧基团的聚丁二烯。 在优选的方面，本发明的组合物还包含交联剂，例如三聚氰胺或环氧化物质，或其混合物。

公开(公告)号：EP0524422A2

公开(公告)日：1993-01-27

申请号：EP92110053.3

申请日：1992-06-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R. ,  Staniunas, Richard

IPC: C23C18/48 ,  C23C18/52

CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

Abstract translation: 一种用于增加锡铅合金沉积物的回流能力并增加其对下面的基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该方法在印刷电路板的制造中是有用的。

公开(公告)号：EP0490118A1

公开(公告)日：1992-06-17

申请号：EP91119515.4

申请日：1991-11-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R.

IPC: G03F7/033 ,  G03F7/32 ,  H05K3/34

CPC classification number: G03F7/32 ,  G03F7/033 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/184 ,  H05K3/287 ,  H05K2203/0793

Abstract: An aqueous developable light sensitive composition comprising an organic solution of at least one polymer having polar group substitution, a photoinitiator and an unsaturated cross linking or polymerizable monomer. The composition is developable with an aqueous solution of a weak organic acid following exposure to activating radiation and baking. A cured photoimaged mask from said composition has properties suitable for use of the composition as a photoimagable solder mask for printed circuit boards and for serving as a permanent dielectric mask in the manufacture of full additive printed circuit boards. Alternatively, the photoimaged mask can be utilized as a temporary mask for many applications due to its unexpected resistance to harsh chemical solutions including both strong acid and strong alkali solutions, and due to its adhesion to copper and other metals as well as to many nonconductive substrate materials.

Abstract translation: 一种水性可显影光敏组合物，其包含至少一种具有极性取代基的聚合物的有机溶液，光引发剂和不饱和交联或可聚合单体。 在暴露于活化辐射和烘烤之后，组合物可用弱有机酸的水溶液显影。 来自所述组合物的固化的光刻掩模具有适合于将该组合物用作印刷电路板的光可光刻焊接掩模并用作制造全部添加剂印刷电路板中的永久介电掩模的性质。 或者，由于其对包括强酸和强碱溶液在内的苛刻化学溶液的意想不到的耐受性以及由于其对铜和其它金属的粘附以及许多非导电基材而导致的，对于许多应用，可以将光刻掩模用作临时掩模 材料。