摘要:
The invention relates to a machine (1) for the separative machining of a plate-shaped workpiece (2) by means of a machining beam (3), comprising: a first moving device (7) for moving the workpiece (2) in a first direction (X), a second moving device (11) for moving a machining head (9), which orients the machining beam (3) toward the workpiece (2), in a second direction (Y) perpendicular to the first direction, and two workpiece-supporting surfaces (4, 5) for supporting the workpiece (2), between which workpiece-supporting surfaces a gap (6) extending in the second direction (Y) is formed. At least two supporting slides (13a, 13b) that can be moved independently of each other in the second direction (Y) are arranged within the gap (6). The at least two supporting slides each have a supporting surface (14a, 14b) for supporting workpiece parts (18) that are cut during the separative machining. The invention further relates to a method for the separative machining of workpieces (2) by means of such a machine, comprising: positioning at least two of the supporting slides (13a, 13b) under a workpiece part (18) to be cut free during the separative machining.
摘要:
The invention relates to a machine (1) for the separative machining of a plate-shaped workpiece (2) by means of a machining beam (3), said machine comprising: a first moving device (7) for moving the workpiece (2) in a first direction (X), a second moving device (11) for moving a machining head (9), which orients the machining beam (3) toward the workpiece (2), in a second direction (Y) perpendicular to the first direction, and two workpiece-supporting surfaces (4, 5) for supporting the workpiece (2), between which a gap (6) extending in the second direction (Y) is formed. At least one supporting slide (13) that can be moved in the second direction (Y) is arranged within the gap (6) and has a supporting surface (14) for supporting workpiece parts that are cut during the separative machining. The invention further relates to a method for the separative machining of a workpiece (2) on such a machine (1), said method comprising: selecting a position of the supporting slide (13) in the gap (6) on the basis of the size and/or the thickness of a workpiece part to be cut free from the workpiece (2) during the separative machining.