摘要:
The invention provides an apparatus and method for spraying a single side of a printed circuit board (11) with a reactive spray. The apparatus (10) comprises a conveyor table (14), spray nozzles (38) located below the conveyor table (14) and a protective cover (18) above the conveyor table (14). The printed circuit boards (11) to be sprayed are sandwiched between the cover (18) and the conveyor table (14). The cover (18) prevents reactive spray from contacting top sides of the printed circuit board (11) while also maintaining the boards (11) against the conveyor table (14) such that bottom sides of the boards (11) can be sprayed without risk of reactive spray contacting the top sides of the boards (11) or dislodging the boards (11) from the conveyor table (14) by the upwardly sprayed reactive spray.
摘要:
The invention provides an apparatus and method for spraying a single side of a printed circuit board (11) with a reactive spray. The apparatus (10) comprises a conveyor table (14), spray nozzles (38) located below the conveyor table (14) and a protective cover (18) above the conveyor table (14). The printed circuit boards (11) to be sprayed are sandwiched between the cover (18) and the conveyor table (14). The cover (18) prevents reactive spray from contacting top sides of the printed circuit board (11) while also maintaining the boards (11) against the conveyor table (14) such that bottom sides of the boards (11) can be sprayed without risk of reactive spray contacting the top sides of the boards (11) or dislodging the boards (11) from the conveyor table (14) by the upwardly sprayed reactive spray.