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公开(公告)号:EP0972306A1
公开(公告)日:2000-01-19
申请号:EP98914554.5
申请日:1998-04-03
申请人: SILENT SYSTEMS, INC.
IPC分类号: H01L23/367 , H01L23/467
CPC分类号: H01L23/467 , H01L23/3672 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要: A folded fin heat sink to be clamped onto circuit components in need of cooling, in particular CPUs. Ridges designed to optimise air flow. Suited to use with a fan to force air movement.
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公开(公告)号:EP0760115B1
公开(公告)日:2003-03-12
申请号:EP95921295.2
申请日:1995-05-17
申请人: SILENT SYSTEMS, INC.
发明人: WYLER, Gregory, T.
CPC分类号: G11B33/1426 , G06F1/18 , G06F1/182 , G06F1/20 , G11B33/08 , G11B33/14 , G11B33/1406
摘要: A computer including an acoustically shielded hard disk drive. Exhaust vents are provided in the computer housing above a convectively cooled power supply. The power supply and, if necessary, a plurality of fans mounted inboard from the intake vents, move the air throughout the computer. The resulting computer produces no more than 25 decibels of noise when in operation. A sound absorption layer surrounds the disk drive assembly. A heat sink mounted exterior to the sound absorption layer is connected by a heat conductive path to the disk drive assembly so as to conduct heat from the disk drive out to the exteriorly mounted heat sink. The disk drive may be immediately surrounded by a fluid containing pouch and a metal bracket.
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公开(公告)号:EP0760115A1
公开(公告)日:1997-03-05
申请号:EP95921295.0
申请日:1995-05-17
申请人: SILENT SYSTEMS, INC.
发明人: WYLER, Gregory, T.
CPC分类号: G11B33/1426 , G06F1/18 , G06F1/182 , G06F1/20 , G11B33/08 , G11B33/14 , G11B33/1406
摘要: A computer including an acoustically shielded hard disk drive. Exhaust vents are provided in the computer housing above a convectively cooled power supply. The power supply and, if necessary, a plurality of fans mounted inboard from the intake vents, move the air throughout the computer. The resulting computer produces no more than 25 decibels of noise when in operation. A sound absorption layer surrounds the disk drive assembly. A heat sink mounted exterior to the sound absorption layer is connected by a heat conductive path to the disk drive assembly so as to conduct heat from the disk drive out to the exteriorly mounted heat sink. The disk drive may be immediately surrounded by a fluid containing pouch and a metal bracket.
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