公开(公告)号：EP1646081B1

公开(公告)日：2018-09-05

申请号：EP04747194.1

申请日：2004-07-08

Applicant: SONY CHEMICALS CORPORATION

Inventor： MATSUMURA, Takashi c/o Sony Chemicals Corp. ,  ANDO, Hisashi c/o Sony Chemicals Corp. ,  KANISAWA, Shiyuki c/o Sony Chemicals Corp. ,  SUGA, Yasuhiro c/o Sony Chemicals Corp. ,  KUDO, Noriaki c/o Sony Chemicals Corp.

IPC: H01L21/60 ,  H05K3/32 ,  B30B5/02 ,  B30B15/06 ,  H01L23/488 ,  H01L21/67

CPC classification number: B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The present invention is a mounting method including the step of thermocompression bonding an IC chip 20 onto a wiring board 10 by using an anisotropic conductive adhesive film 7. During the thermocompression bonding, a top region of the IC chip 20 is pressed against the wiring board 10 with a predetermined pressure, and a side region of the IC chip 20 is pressed with a pressure smaller than the pressure applied to the top region of the IC chip 20. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion 6 of a thermocompression bonding head 4. The anisotropic conductive adhesive film 7 contains a binding resin 7b having melting viscosity of 1.0 x 10 2 mPa · s or more and 1.0 x 10 5 mPa·s or less.

公开(公告)号：EP1646081A1

公开(公告)日：2006-04-12

申请号：EP04747194.1

申请日：2004-07-08

Applicant: SONY CHEMICALS CORPORATION

Inventor： MATSUMURA, Takashi c/o Sony Chemicals Corp. ,  ANDO, Hisashi c/o Sony Chemicals Corp. ,  KANISAWA, Shiyuki c/o Sony Chemicals Corp. ,  SUGA, Yasuhiro c/o Sony Chemicals Corp. ,  KUDO, Noriaki c/o Sony Chemicals Corp.

IPC: H01L21/60 ,  H05K3/32

CPC classification number: B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive.
The present invention is a mounting method including the step of thermocompression bonding an IC chip 20 onto a wiring board 10 by using an anisotropic conductive adhesive film 7. During the thermocompression bonding, a top region of the IC chip 20 is pressed against the wiring board 10 with a predetermined pressure, and a side region of the IC chip 20 is pressed with a pressure smaller than the pressure applied to the top region of the IC chip 20. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion 6 of a thermocompression bonding head 4. The anisotropic conductive adhesive film 7 contains a binding resin 7b having melting viscosity of 1.0 x 10 2 mPa · s or more and 1.0 x 10 5 mPa·s or less.