公开(公告)号：EP2534680B1

公开(公告)日：2018-12-05

申请号：EP11704332.3

申请日：2011-02-09

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： KOETSE, Marinus, Marc ,  SCHOO, Harmannus, Franciscus, Maria ,  DE KOK, Margaretha, Maria

IPC: H05K3/32 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K13/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/27505 ,  H01L2224/27515 ,  H01L2224/29076 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/105 ,  H05K3/303 ,  H05K3/32 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2203/1545 ,  Y02P70/613 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1158 ,  Y10T156/1195 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0665 ,  H01L2924/00

Abstract: According to one aspect, the invention provides a method of placement of a component on a stretchable substrate, comprising the steps of providing a base substrate having a stretchable substrate layer, providing a flexible foil comprising an integral arrangement (20) of a multiple of flexible foil components; the flexible foil components each comprising component pads for electro/optical access to the flexible foil components, providing in plane interconnecting traces on the stretchable substrate layer in correspondence with the component pads in the integral arrangement; aligning the base substrate and the flexible foil so as to be used in a reel based manufacturing process; providing, through lamination of the base substrate and the flexible foil an electro/optical via connection between the traces and the component pads of the integral component arrangement; and mechanically separating the integral arrangement of flexible foil components to provide a multiple of mechanically separated components from each other to arrange an electro/optical interconnected component system on a stretchable substrate layer One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.

公开(公告)号：EP3224861B1

公开(公告)日：2018-10-24

申请号：EP15771448.6

申请日：2015-09-18

Applicant: Raytheon Company

Inventor： REZA, Shahed ,  ALTMAN, David, H. ,  TRULLI, Susan, C.

IPC: H01L23/66 ,  H01L23/36 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/535 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2223/6605 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/131 ,  H01L2224/14165 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27312 ,  H01L2224/29013 ,  H01L2224/29078 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section.

公开(公告)号：EP2617515B1

公开(公告)日：2018-10-10

申请号：EP11814671.1

申请日：2011-08-03

Applicant: Senju Metal Industry Co., Ltd

Inventor： SAKAMOTO Yoshitsugu ,  YAMADA Hiroyuki ,  YAMANAKA Yoshie ,  OHNISHI Tsukasa ,  YOSHIKAWA Shunsaku ,  TADOKORO Kenzo

IPC: B23K35/14 ,  B22F3/26 ,  B23K1/00 ,  B23K35/26 ,  B23K35/30 ,  B23K35/40 ,  C22C9/02 ,  C22C13/00 ,  H01L21/52 ,  H05K3/34 ,  B23K101/40 ,  B23K35/02 ,  C22C1/08 ,  H01L23/373 ,  H01L23/00

CPC classification number: B23K35/262 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/302 ,  B23K2101/40 ,  C22C1/08 ,  C22C9/02 ,  C22C13/00 ,  H01L23/3735 ,  H01L24/07 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/8309 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/203 ,  H05K3/3463 ,  H05K2201/0116 ,  Y10T428/12479 ,  H01L2924/00014 ,  C22C1/0483 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/0002

Abstract: A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.

公开(公告)号：EP2381473B1

公开(公告)日：2018-10-03

申请号：EP11156124.7

申请日：2011-02-28

Applicant: Robert Bosch GmbH ,  SEG Automotive Germany GmbH

Inventor： Spitz, Richard ,  Jaros, Rolf ,  Goerlach, Alfred ,  Suelzle, Helmut

IPC: H01L23/051 ,  H01L29/861 ,  H01L29/06 ,  H01L29/16 ,  H01L29/20

CPC classification number: H01L23/051 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L29/0615 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/861 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83051 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2109881B1

公开(公告)日：2018-09-26

申请号：EP07749694.1

申请日：2007-01-31

Applicant: Henkel AG & Co. KGaA

Inventor： EUNSOOK, Chae

IPC: H01L21/027 ,  H01L21/08

CPC classification number: H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27416 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2937 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/27

Abstract: This invention is a semiconductor wafer having an active side and a back side opposite the active side, which back side is coated with a filled, spin-coatable coating, wherein the coating comprises a resin and a spherical filler characterized by an average particle diameter of greater than 2 µm and a single peak particle size distribution. In another embodiment the invention is a method for producing a spin- coatable, B-stageable coating with a thixotropic index of 1.2 or less. In a third embodiment the invention is a method for producing a coated semiconductor wafer.

公开(公告)号：EP1646081B1

公开(公告)日：2018-09-05

申请号：EP04747194.1

申请日：2004-07-08

Applicant: SONY CHEMICALS CORPORATION

Inventor： MATSUMURA, Takashi c/o Sony Chemicals Corp. ,  ANDO, Hisashi c/o Sony Chemicals Corp. ,  KANISAWA, Shiyuki c/o Sony Chemicals Corp. ,  SUGA, Yasuhiro c/o Sony Chemicals Corp. ,  KUDO, Noriaki c/o Sony Chemicals Corp.

IPC: H01L21/60 ,  H05K3/32 ,  B30B5/02 ,  B30B15/06 ,  H01L23/488 ,  H01L21/67

CPC classification number: B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The present invention is a mounting method including the step of thermocompression bonding an IC chip 20 onto a wiring board 10 by using an anisotropic conductive adhesive film 7. During the thermocompression bonding, a top region of the IC chip 20 is pressed against the wiring board 10 with a predetermined pressure, and a side region of the IC chip 20 is pressed with a pressure smaller than the pressure applied to the top region of the IC chip 20. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion 6 of a thermocompression bonding head 4. The anisotropic conductive adhesive film 7 contains a binding resin 7b having melting viscosity of 1.0 x 10 2 mPa · s or more and 1.0 x 10 5 mPa·s or less.

公开(公告)号：EP3221888A4

公开(公告)日：2018-07-11

申请号：EP15860345

申请日：2015-11-19

Applicant: MICRON TECHNOLOGY INC

Inventor： YE SENG KIM ,  NG HONG WAN

IPC: H01L25/065 ,  G06F13/16 ,  H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/48 ,  H01L23/49 ,  H01L25/18

CPC classification number: H01L25/0657 ,  G06F13/1668 ,  G06F13/1694 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/04 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/13083 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81855 ,  H01L2224/81856 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/92227 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/83101 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/83

Abstract: Memory devices with controllers under stacks of memory packages and associated systems and methods are disclosed herein. In one embodiment, a memory device is configured to couple to a host and can include a substrate, a stack of memory packages, and a controller positioned between the stack and the substrate. The controller can manage data stored by the memory packages based on commands from the host.

公开(公告)号：EP2548678B1

公开(公告)日：2018-07-11

申请号：EP10847952.8

申请日：2010-04-23

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： ENDOH, Keiichi ,  HISAEDA, Yutaka ,  MIYAZAWA, Akihiro ,  NAGAHARA, Aiko ,  UEYAMA, Toshihiko

IPC: B22F1/00 ,  B22F1/02 ,  B22F7/06 ,  B22F9/24 ,  C22C5/06 ,  H01B1/02 ,  H05K3/32 ,  H01L21/52 ,  H01L23/00 ,  B23K1/00 ,  B23K35/00 ,  B23K35/36 ,  B82Y30/00 ,  B23K1/20 ,  B23K35/30 ,  B23K35/02

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300°C or lower.

公开(公告)号：EP2592126B1

公开(公告)日：2018-03-21

申请号：EP11803415.6

申请日：2011-06-10

Applicant: Toray Industries, Inc.

Inventor： MATSUMURA, Kazuyuki ,  SUGIMOTO, Kanako ,  NIWA, Hiroyuki ,  INAGAKI, Chikara

IPC: C09J179/08 ,  C09J7/00 ,  C09J11/06 ,  C09J163/00 ,  H01L21/301 ,  H01L21/60 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: G03F7/031 ,  C08G59/68 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/1053 ,  C08G73/106 ,  C08L79/08 ,  C08L2312/06 ,  C09J163/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/81204 ,  H01L2224/83204 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  C08L63/00 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160°C or higher. The photosensitive adhesive composition of the present invention has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.

公开(公告)号：EP2157842B1

公开(公告)日：2018-03-14

申请号：EP08752738.8

申请日：2008-05-14

Applicant: Fujikura, Ltd.

Inventor： HONDO, Takaharu

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2924/01006 ,  H01L2924/01322 ,  H01L2924/0665 ,  H05K3/0035 ,  H05K3/382 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4617 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/0346 ,  H05K2203/0392 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Wiring board bases 2 to 4 are provided with: insulating substrates 1a to 4a having conductive layers 1b to 4b provided on one surfaces thereof, respectively; through-holes 2e to 4e which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias 2d to 4d connected to the conductive layers by filling the through-holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is stacked. Before the through-hole is filled with the conductive paste, a surface portion, in the through-hole, of the conductive layer is smoothed and a smooth surface portion 2g is formed.