公开(公告)号：EP1884981A1

公开(公告)日：2008-02-06

申请号：EP06118420.6

申请日：2006-08-03

申请人： STMicroelectronics Ltd (Malta)

发明人： Formosa, Kevin

IPC分类号： H01L21/00 ,  H01L21/68 ,  H01L21/78

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

摘要： The present invention relates to a removable wafer expander for a die bonding equipment for singularized wafer (7) supported by flexible sticky means (8). Said removable wafer expander is provided with a first ring member (2) to be coupled with a second ring member (3) for a remote expansion of said flexible sticky means (8) comprises therebetween before the mounting of said wafer expander onto the die bonding equipment.

摘要翻译： 本发明涉及用于由柔性粘性装置（8）支撑的单晶化晶片（7）的晶片键合设备的可移除晶片扩展器。 所述可移除晶片扩展器设置有第一环构件（2），所述第一环构件与第二环构件（3）耦合，用于在所述晶片扩展器安装到管芯接合之前，所述柔性粘性构件（8）包括其间的远程扩展 设备。