INTEGRATED ELECTRONIC DEVICE FOR DETECTING ULTRAVIOLET RADIATION
    3.
    发明公开
    INTEGRATED ELECTRONIC DEVICE FOR DETECTING ULTRAVIOLET RADIATION 有权
    INTEGRIERTE ELEKTRONISCHE VORRICHTUNG ZUR DETEKTION ULTRAVIOLETTER STRAHLUNG

    公开(公告)号:EP3098859A1

    公开(公告)日:2016-11-30

    申请号:EP15200618.5

    申请日:2015-12-16

    Abstract: An integrated electronic device for detecting the composition of ultraviolet radiation, including: a cathode region (6, 8) formed by a semiconductor material with a first type of conductivity; and a first anode region (10; 410; 510) and a second anode region (12; 412; 512), which are laterally staggered with respect to one another and are set in contact with the cathode region. The cathode region and the first anode region form a first sensor (32). The cathode region and the second anode region form a second sensor (34). In a spectral range formed by the UVA band and by the UVB band, the first and second sensors have, respectively, a first spectral responsivity and a second spectral responsivity different from one another.

    Abstract translation: 一种用于检测紫外线辐射的组成的集成电子装置,包括:由具有第一类导电性的半导体材料形成的阴极区(6,8) 以及第一阳极区域(10; 410; 510)和第二阳极区域(12; 412; 512),其相对于彼此横向交错并且被设置为与阴极区域接触。 阴极区域和第一阳极区域形成第一传感器(32)。 阴极区域和第二阳极区域形成第二传感器(34)。 在由UVA波段和UVB波段形成的光谱范围内,第一和第二传感器分别具有彼此不同的第一光谱响应度和第二光谱响应度。

    PROCESS FOR WORKING A WAFER OF 4H-SIC MATERIAL TO FORM A 3C-SIC LAYER IN DIRECT CONTACT WITH THE 4H-SIC MATERIAL

    公开(公告)号:EP4246553A1

    公开(公告)日:2023-09-20

    申请号:EP23160409.1

    申请日:2023-03-07

    Abstract: Process for manufacturing a 3C-SiC layer (4; 24), comprising the steps of: providing a wafer (1; 21) of 4H-SiC, provided with a surface (1a; 21a); heating, through a LASER beam (102), a selective portion of the wafer (1; 21) at least up to a melting temperature of the material of the selective portion; allowing the cooling and crystallization of the melted selective portion, thus forming the 3C-SiC layer (4; 24), a Silicon layer (6a; 26a) on the 3C-SiC layer and a carbon-rich layer (6b; 26b) above the Silicon layer (6a; 26a); completely removing the carbon-rich layer (6; 26) and the Silicon layer (6a; 26a), exposing the 3C-SiC layer (4; 24). If the Silicon layer (6a; 26a) is maintained on the 4H-SiC wafer, the process leads to the formation of a Silicon layer on the 4H-SiC wafer.
    The 3C-SiC or Silicon layer thus formed may be used for the integration, even only partial, of electrical or electronic components.

    INTEGRATED ELECTRONIC DEVICE FOR DETECTING ULTRAVIOLET RADIATION
    7.
    发明授权
    INTEGRATED ELECTRONIC DEVICE FOR DETECTING ULTRAVIOLET RADIATION 有权
    用于检测紫外线辐射的集成电子设备

    公开(公告)号:EP3098859B1

    公开(公告)日:2018-02-07

    申请号:EP15200618.5

    申请日:2015-12-16

    Abstract: An integrated electronic device for detecting the composition of ultraviolet radiation, including: a cathode region (6, 8) formed by a semiconductor material with a first type of conductivity; and a first anode region (10; 410; 510) and a second anode region (12; 412; 512), which are laterally staggered with respect to one another and are set in contact with the cathode region. The cathode region and the first anode region form a first sensor (32). The cathode region and the second anode region form a second sensor (34). In a spectral range formed by the UVA band and by the UVB band, the first and second sensors have, respectively, a first spectral responsivity and a second spectral responsivity different from one another.

    METHOD FOR MANUFACTURING A SIC ELECTRONIC DEVICE WITH REDUCED HANDLING STEPS, AND SIC ELECTRONIC DEVICE

    公开(公告)号:EP3876263A1

    公开(公告)日:2021-09-08

    申请号:EP21161040.7

    申请日:2021-03-05

    Abstract: Method for manufacturing an electronic device (50) based on SiC, comprising the steps of: arranging a substrate (53) of SiC; forming a structural layer (52) of SiC on a front of the substrate; forming, in the structural layer (52), active regions of said electronic device (50), said active regions having a role in the generation and/or conduction of electric current during the use of the electronic device (50); forming, on the structural layer (52), a first electric terminal (58); forming an intermediate layer (72) of Titanium at the back of the substrate; heating the intermediate layer (72) by means of a LASER beam (82) in order to generate local heating such as to favor the formation of an ohmic contact of Titanium compounds; and forming, on the intermediate layer, a second electric terminal (57) of the electronic device.

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