公开(公告)号：EP4276889A1

公开(公告)日：2023-11-15

申请号：EP23172009.5

申请日：2023-05-08

Applicant: STMicroelectronics S.r.l.

Inventor： GOTTARDI, Thomas ,  MODARELLI, Nicoletta ,  CATALANO, Guendalina

IPC: H01L21/60 ,  H01L23/492 ,  H01L23/495

Abstract: A semiconductor die (14) is attached on a die-attachment portion (12A) of a planar substrate (12) and a planar electrically conductive clip (16) in mounted onto the semiconductor die (14). The electrically conductive clip (16) has a distal portion (16A) extending away from the semiconductor die (14) with the semiconductor die (14) sandwiched between the substrate (12) and the at least one electrically conductive clip (16). The substrate (12) includes electrically conductive leads (12B) arranged facing the distal portion (16A) of the electrically conductive clip (16) with a gap (G) formed therebetween.
The gap (G) is filled with a mass of gap-filling material (20) transferred to the gap (G) via Laser Induced Forward Transfer, LIFT processing, the mass (20) sized and dimensioned to fill the gap (G).