公开(公告)号：EP2644307A4

公开(公告)日：2017-12-20

申请号：EP11843305

申请日：2011-11-22

申请人： SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELECTRIC HARDMETAL CORP ,  AIST

发明人： ISHIDA TOMOYUKI ,  MORIGUCHI HIDEKI ,  NAKASHIMA TAKERU ,  KUKINO SATORU ,  YURUGI SHINICHIRO ,  ENAMI TERUHIRO ,  OKAMURA KATSUMI ,  MATSUDA YUSUKE ,  SANO KOJI ,  KOBAYASHI KEIZO ,  OZAKI KIMIHIRO

IPC分类号： B23K20/00 ,  B23B27/18 ,  B23B27/20 ,  B23K1/008 ,  B23K1/19 ,  B23K13/00 ,  B23K35/30 ,  C22C9/06 ,  C22C14/00 ,  C22C19/00

CPC分类号： C22C1/023 ,  B23B2222/88 ,  B23B2224/36 ,  B23B2226/125 ,  B23B2240/08 ,  B23K1/0004 ,  B23K1/0008 ,  B23K1/008 ,  B23K1/19 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K31/025 ,  B23K35/001 ,  B23K35/302 ,  B23K35/3033 ,  B23K2201/20 ,  B23K2203/18 ,  B23K2203/52 ,  C22C1/02 ,  C22C9/00 ,  C22C9/06 ,  Y10T403/479

摘要： The present joined product is a joined product with a cemented carbide sintered compact serving as a first material to be joined (1) and a cBN sintered compact serving as a second material to be joined (2), wherein: the first material to be joined (1) and the second material to be joined (2) are joined together via a joining material (3) disposed therebetween and containing titanium (Ti); and a titanium nitride (TiN) compound layer having a thickness of 10-300 nm is produced at an interface between the second material to be joined (2) and the joining material (3).

公开(公告)号：EP2272609A4

公开(公告)日：2017-01-25

申请号：EP09727814

申请日：2009-03-27

申请人： NAT INST ADVANCED IND SCIENCE & TECH ,  SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELECTRIC HARDMETAL CORP

发明人： OZAKI KIMIHIRO ,  KOBAYASHI KEIZO ,  MORIGUCHI HIDEKI ,  ISHIDA TOMOYUKI ,  IKEGAYA AKIHIKO ,  KITAGAWA NOBUYUKI

IPC分类号： B23B27/18 ,  B22F7/06 ,  B23K1/00 ,  B23K1/19 ,  B23K11/16 ,  B23K11/30 ,  B23K101/20 ,  B23K103/18 ,  B23P15/28

CPC分类号： B23K1/19 ,  B22F7/064 ,  B23B2226/125 ,  B23B2226/315 ,  B23B2240/08 ,  B23K1/0004 ,  B23K11/16 ,  B23K11/3009 ,  B23K20/021 ,  B23K20/16 ,  B23K35/005 ,  B23K35/3033 ,  B23K35/3046 ,  B23K35/325 ,  B23K2201/20 ,  B23K2203/18 ,  C22C26/00 ,  C22C29/06 ,  C23C16/00 ,  Y10T407/26 ,  Y10T407/27 ,  Y10T428/30 ,  Y10T428/31678

公开(公告)号：EP2397246A4

公开(公告)日：2016-06-15

申请号：EP10780571

申请日：2010-05-26

申请人： NAT INST OF ADVANCED IND SCIEN ,  SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC HARDMETAL CORP

发明人： OZAKI KIMIHIRO ,  KOBAYASHI KEIZO ,  MORIGUCHI HIDEKI ,  ISHIDA TOMOYUKI ,  IKEGAYA AKIHIKO ,  FUKAYA TOMOHIRO ,  HIRAO TAKASHI ,  NAKASHIMA TAKERU ,  NISHIMURA MITSUO ,  FUJIMURA AKIO

IPC分类号： B23B27/18 ,  B23B27/20 ,  B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K3/04 ,  B23K20/00 ,  B23K20/02 ,  B23K20/16 ,  B23K20/22 ,  B23K31/02 ,  B23K35/32 ,  B23K101/20 ,  B23K103/18

CPC分类号： B23K31/025 ,  B23B27/18 ,  B23B2226/125 ,  B23B2226/315 ,  B23B2240/00 ,  B23K1/0008 ,  B23K1/19 ,  B23K20/008 ,  B23K20/023 ,  B23K20/16 ,  B23K20/22 ,  B23K35/325 ,  B23K35/327 ,  B23K2201/20 ,  B23K2201/34 ,  B23K2203/18 ,  B23K2203/52 ,  Y10T428/31678

摘要： A joined product according to the present invention is a joined product including a cemented carbide sintered compact serving as a first material (1) to be joined and a cBN sintered compact or a diamond sintered compact serving as a second material (3) to be joined. The first material (1) to be joined and the second material (3) to be joined are joined by a joining material (2) that forms a liquid phase at a temperature exceeding 800°C and lower than 1000°C and that is placed between the first material (1) to be joined and the second material (3) to be joined. The first material (1) to be joined and the second material (3) to be joined are joined by resistance heating and pressing at a pressure of 0.1 to 200 MPa.

摘要翻译： 根据本发明的接合产品是包括用作待接合的第一材料（1）的硬质合金烧结体和用作待连接的第二材料（3）的cBN烧结体或金刚石烧结体的接合产品 。 要接合的第一材料（1）和待接合的第二材料（3）通过在超过800℃且低于1000℃的温度下形成液相的接合材料（2）接合，并且被放置 在待接合的第一材料（1）和待接合的第二材料（3）之间。 要连接的第一材料（1）和待接合的第二材料（3）通过电阻加热和压力在0.1至200MPa的压力下接合。

公开(公告)号：EP3330985A4

公开(公告)日：2018-07-04

申请号：EP16832510

申请日：2016-07-28

申请人： JFE STEEL CORP ,  JFE PREC CORPORATION ,  TOKIN CORP ,  AIST

发明人： NAKAMURA NAOMICHI ,  NAKASEKO MAKOTO ,  TAKASHITA TAKUYA ,  MURAKI MINEO ,  TERAO HOSHIAKI ,  WADA RAITA ,  URATA AKIRI ,  KANAMORI YU ,  YAMAKI MAKOTO ,  OKAMOTO KOICHI ,  TSUDA TOSHINORI ,  SATO SHOICHI ,  OZAKI KIMIHIRO

IPC分类号： H01F41/02 ,  B22F1/00 ,  B22F1/02 ,  B22F3/00 ,  B22F3/02 ,  B22F3/03 ,  B22F3/14 ,  C22C33/02 ,  C22C38/00 ,  C22C45/02 ,  H01F1/153 ,  H01F1/22 ,  H01F1/24 ,  H01F3/08 ,  H01F27/255

CPC分类号： B22F3/14 ,  B22F1/00 ,  B22F1/02 ,  B22F3/00 ,  B22F3/02 ,  B22F3/03 ,  B22F2301/35 ,  B22F2304/10 ,  C22C33/02 ,  C22C38/00 ,  C22C38/002 ,  C22C38/02 ,  C22C38/16 ,  C22C45/02 ,  C22C2200/02 ,  C22C2200/04 ,  C22C2202/02 ,  H01F1/15308 ,  H01F1/15325 ,  H01F1/15333 ,  H01F1/15375 ,  H01F3/08 ,  H01F27/255 ,  H01F41/0246

摘要： Provided is a soft magnetic dust core having high density and favorable properties. A method of manufacturing a soft magnetic dust core includes: preparing coated powder including amorphous powder made of an Fe-B-Si-P-C-Cu-based alloy, an Fe-B-P-C-Cu-based alloy, an Fe-B-Si-P-Cu-based alloy, or an Fe-B-P-Cu-based alloy, with a first initial crystallization temperature T x1 and a second initial crystallization temperature T x2 ; and a coating formed on a surface of particles of the amorphous powder; applying a compacting pressure to the coated powder or a mixture of the coated powder and the amorphous powder at a temperature equal to or lower than T x1 - 100 K; and heating to a maximum end-point temperature equal to or higher than T x1 - 50 K and lower than T x2 with the compacting pressure being applied.