公开(公告)号：EP3261418A4

公开(公告)日：2018-07-25

申请号：EP16829761

申请日：2016-07-14

申请人： SUZHOU WEIPENG ELECTRICAL TECH CO LTD

发明人： MENG YUEDONG ,  CHANG PENG ,  CAI GANGQIANG

IPC分类号： H05K3/02 ,  C23C14/20 ,  C23C18/16 ,  C25D3/38 ,  H05K3/38

CPC分类号： H05K3/188 ,  C23C14/205 ,  C23C18/1633 ,  C25D3/38 ,  H05K1/028 ,  H05K1/09 ,  H05K3/02 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2203/095

摘要： A method for preparing an adhesive-free polyimide flexible printed circuit board is provided. The method includes the following steps: 1) placing a polyimide thin film into a low vacuum environment, and treating the polyimide thin film using plasma produced by capacitively coupled discharge of an organic amine; 2) placing the polyimide thin film obtained in step 1) into a low vacuum environment, and pretreating the polyimide thin film using plasma formed by capacitively coupled discharge of a nitrogen gas bubbled through a metal salt solution; 3) pre-plating the polyimide thin film obtained in step 2) using vacuum sputtering or chemical plating so as to obtain a dense copper film with a thickness of less than 100 nm; and 4) thickening the copper film to a required thickness by means of an electroplating method. The method not only eliminates an adhesive, but also can simplify the process, reduce labor investment, decrease costs, and cut down environmental pollution. This method can be used for manufacturing an ultrathin adhesive-free flexible printed circuit board.