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公开(公告)号：EP4442087A1
公开(公告)日：2024-10-09
申请号：EP23760878.1
申请日：2023-02-22
申请人： CELLINK CORPORATION
发明人： ORTIZ, Jean-Paul , BROWN, Malcolm Parker , TERLAAK, Mark , FINDLAY, Will , COAKLEY, Kevin Michael , ANDERSON, Casey
CPC分类号： H05K2201/05520130101 , H05K1/028 , H05K2201/0902720130101
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公开(公告)号：EP4366476A3
公开(公告)日：2024-07-31
申请号：EP24164671.0
申请日：2019-11-13
发明人： Kim, Gidae , Baek, Moohyun , Lee, Minsung , Choi, Jongchul
CPC分类号： H04M1/0216 , H04M1/0268 , H04M1/18 , H05K1/148 , H05K1/028 , H05K2201/1018920130101 , G06F1/1683 , G06F1/1616 , G06F1/1656 , G06F1/1652
摘要： An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.
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公开(公告)号：EP4366476A2
公开(公告)日：2024-05-08
申请号：EP24164671.0
申请日：2019-11-13
发明人： Kim, Gidae , Baek, Moohyun , Lee, Minsung , Choi, Jongchul
IPC分类号： H05K1/14
CPC分类号： H04M1/0216 , H04M1/0268 , H04M1/18 , H05K1/148 , H05K1/028 , H05K2201/1018920130101 , G06F1/1683 , G06F1/1616 , G06F1/1656 , G06F1/1652
摘要： An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.
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公开(公告)号：EP4363760A1
公开(公告)日：2024-05-08
申请号：EP22740324.3
申请日：2022-06-24
申请人： Signify Holding B.V.
发明人： VAN DE SLUIS, Bartel, Marinus , ROZENDAAL, Leendert, Teunis , KRIJN, Marcellinus, Petrus, Carolus, Michael , VISSENBERG, Michel, Cornelis, Josephus, Marie
IPC分类号： F21S4/24 , H04N5/64 , H05K1/02 , F21Y103/10 , F21Y103/20 , F21Y107/30 , F21Y107/70
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公开(公告)号：EP3653924B1
公开(公告)日：2024-04-17
申请号：EP19213280.1
申请日：2011-12-09
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公开(公告)号：EP2992742B1
公开(公告)日：2018-12-05
申请号：EP14721344.1
申请日：2014-04-30
发明人： SEPKHANOV, Ruslan Akhmedovich , DE ZWART, Siebe Tjerk , WEEKAMP, Johannes Wilhelmus , REBERGEN, Johannes Alexander , BUIJS, Arnold
IPC分类号： H05K1/05 , F21S8/02 , F21V7/00 , F21V7/04 , F21K9/60 , F21V7/18 , F21Y115/10 , F21Y107/40 , H05K1/02
CPC分类号： H05K1/028 , F21K9/60 , F21S8/02 , F21V7/0058 , F21V7/048 , F21V7/18 , F21Y2107/40 , F21Y2115/10 , H05K1/0277 , H05K1/056 , H05K2201/055 , H05K2201/10106 , H05K2203/302
摘要： A circuit board (10) for carrying at least one light source (16) of a lighting device and a method of manufacturing such a circuit board are provided. The circuit board comprises a substrate (1), wherein the substrate comprises at least one fold (9) forming a projecting portion and extending from a periphery (3) of the substrate up to an inner portion (2) of the substrate, whereby the substrate has a polygonal funnel shape. The present aspects use the concept of folding the substrate in order to obtain a polygonal funnel shape of the circuit board, whereby shaping of the substrate without requiring removal of material of the substrate is allowed.
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公开(公告)号：EP3285464B1
公开(公告)日：2018-11-28
申请号：EP17176616.5
申请日：2017-06-19
发明人： WU, Shoukuan
IPC分类号： H04M1/02
CPC分类号： G06F3/041 , G06F1/1626 , G06F1/1633 , G06F1/1643 , G06F1/1656 , G06F2203/04103 , G06K9/00006 , H04M1/026 , H04M1/0283 , H04W88/02 , H05K1/028 , H05K1/189 , H05K3/284 , H05K3/32 , H05K2201/10287 , H05K2203/1316
摘要： A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a decoration enclosure, a touch panel, a fingerprint chip package structure and a display screen component, and the touch panel defines a blind hole in a surface thereof. The method for manufacturing the input assembly includes: mounting the fingerprint chip package structure in the decoration enclosure; mounting the decoration enclosure carried with the fingerprint chip package structure in the blind hole; mounting the display screen component to the surface of the touch panel, in which a first orthographic projection of the display screen component in the surface of the touch pane; overlaps a second orthographic projection of the decoration enclosure in the surface of the touch panel.
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公开(公告)号：EP3389348A3
公开(公告)日：2018-10-24
申请号：EP18166959.9
申请日：2018-04-12
发明人： KIM, Min-Soo , KWAK, Kyuijn , LEE, Soo-Gyu , PARK, Sung-Won , CHANG, Joon Won , AN, Jin-Wan , LEE, Janghoon
CPC分类号： G06F1/1658 , G06F1/1626 , G06F1/1635 , G06F1/1637 , G06F1/1643 , G06F1/1656 , G06F1/1698 , G06F1/20 , G06F1/203 , G06F2203/04105 , H01Q1/243 , H02J7/0052 , H04M1/0277 , H05K1/028 , H05K1/05 , H05K1/144 , H05K1/148 , H05K1/181 , H05K5/03 , H05K7/1427 , H05K2201/0311 , H05K2201/042 , H05K2201/09227 , H05K2201/10166
摘要： An electronic device is provided. The electronic device includes a housing comprising a first plate, a second plate apart from the first plate while facing the first plate, and a side member which surrounds a space between the first plate and the second plate, a touchscreen display exposed through the first plate, a printed circuit board (PCB) disposed between the touchscreen display and the second plate, a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, and at least one integrated circuit (IC) mounted on the PCB and relating to power, wherein the mid-plate can include at least one conductive path formed on a surface facing the PCB and electrically connected to the at least one IC, and the at least one conductive path can be formed with the same metallic material as the mid-plate.
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公开(公告)号：EP3383147A1
公开(公告)日：2018-10-03
申请号：EP18166049.9
申请日：2016-03-11
发明人： Ahn, Hyeong-Cheol
CPC分类号： H05K1/189 , G06F3/0412 , G06F3/047 , G06F2203/04102 , H05K1/028 , H05K1/0296 , H05K1/118 , H05K2201/055 , H05K2201/056 , H05K2201/09063 , H05K2201/09781 , H05K2201/10121 , H05K2201/10128 , H05K2201/10136 , H05K2201/10681
摘要： A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film.
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公开(公告)号：EP2874479B1
公开(公告)日：2018-08-08
申请号：EP14748091.7
申请日：2014-06-19
发明人： HWANG, Seung Jae
CPC分类号： H05K7/2039 , B32B5/022 , B32B5/26 , B32B7/02 , B32B7/06 , B32B7/12 , B32B9/007 , B32B9/047 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/12 , B32B27/286 , B32B27/36 , B32B2255/02 , B32B2255/102 , B32B2255/205 , B32B2255/28 , B32B2262/02 , B32B2264/10 , B32B2264/107 , B32B2307/202 , B32B2307/30 , B32B2307/302 , B32B2307/304 , B32B2307/402 , B32B2457/00 , B32B2457/08 , B32B2509/00 , F28F13/003 , F28F13/18 , F28F21/02 , F28F2270/00 , H01L23/36 , H01L23/3733 , H01L23/3737 , H01L2924/0002 , H04M1/0202 , H04M1/026 , H05K1/028 , H01L2924/00
摘要： Provided are an insulation sheet and an electronic apparatus using the same. The insulation sheet includes: a radiating layer that spreads and radiates heat generated from a heat generating component of an electronic apparatus; and an insulating layer that suppresses the heat saturated in the radiating layer from being delivered to the outside of the electronic apparatus.
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