专利检索 ap:("SanDisk Technologies LLC") AND inv:"MASAMORI, Yohei" 第 1 页

1.

发明公开
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONDUCTIVE SUPPORT STRUCTURES AND METHOD OF MAKING THEREOF 审中-公开

公开(公告)号：EP3613078A1

公开(公告)日：2020-02-26

申请号：EP18709223.4

申请日：2018-02-21

申请人： SanDisk Technologies LLC

发明人： MASAMORI, Yohei , OGAWA, Hiroyuki

IPC分类号： H01L27/11526 , H01L27/11548 , H01L27/11565 , H01L27/11573 , H01L27/11575

2.

发明公开
BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN THREE-DIMENSIONAL MEMORY DEVICE 审中-公开

公开(公告)号：EP3494598A1

公开(公告)日：2019-06-12

申请号：EP17771634.7

申请日：2017-09-07

申请人： SanDisk Technologies LLC

发明人： YU, Jixin , KITAMURA, Kento , ZHANG, Tong , GE, Chun , ZHANG, Yanli , SHIMIZU, Satoshi , KASAGI, Yasuo , OGAWA, Hiroyuki , MAO, Daxin , YAMAGUCHI, Kensuke , ALSMEIER, Johann , KAI, James , MATSUMOTO, Kazuyo , MASAMORI, Yohei

IPC分类号： H01L27/11582 , H01L27/11573