公开(公告)号：EP3220494A1

公开(公告)日：2017-09-20

申请号：EP14905924.8

申请日：2014-12-07

申请人： Sanhe Laserconn Tech Co., Ltd.

发明人： LI, Yang

IPC分类号： H01S5/183

CPC分类号： H01S5/18361 ,  H01S5/005 ,  H01S5/02252 ,  H01S5/0228 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4043 ,  H01S5/423 ,  H01S5/426

摘要： Provided is a high-power semiconductor laser based on VCSEL, comprising a VCSEL laser module. The VCSEL laser module includes a VCSEL chip array (1) consisting of a plurality of VCSEL chips (10) and an inner wall reflection optical transmission device (2) which is arranged in front of a light emergent face of the VCSEL chip array (1); and the light emergent face of the VCSEL chip array (1) is used for secondarily reflecting the reflected light reflected by a target object (3) and the inner wall reflection optical transmission device (2). Also provided is a packaging structure for the high-power semiconductor laser. The VCSEL chip array (1) is packaged by an inwardly concave arc-shaped heat sink (4), so that the purpose of converging the laser light beam near a centre position can be achieved. The high-power semiconductor laser based on VCSEL has a wide application prospect in the laser medicine and industrial laser processing fields.

摘要翻译： 提供了一种基于VCSEL的高功率半导体激光器，包括VCSEL激光器模块。 VCSEL激光模块包括由多个VCSEL芯片（10）组成的VCSEL芯片阵列（1）和布置在VCSEL芯片阵列（1）的光出射面之前的内壁反射光学传输装置（2） ）; 并且VCSEL芯片阵列（1）的出光面用于二次反射由目标物体（3）和内壁反射光学传输装置（2）反射的反射光。 还提供了用于高功率半导体激光器的封装结构。 VCSEL芯片阵列（1）由向内凹陷的弧形散热器（4）封装，从而可以实现将激光束会聚在中心位置附近的目的。 基于VCSEL的高功率半导体激光器在激光医疗和工业激光加工领域具有广阔的应用前景。

公开(公告)号：EP3219360B1

公开(公告)日：2020-05-06

申请号：EP14905708.5

申请日：2014-12-07

申请人： Sanhe Laserconn Tech Co., Ltd.

发明人： LI, Yang ,  LI, Delong

IPC分类号： A61N5/00

公开(公告)号：EP3219360A1

公开(公告)日：2017-09-20

申请号：EP14905708.5

申请日：2014-12-07

申请人： Sanhe Laserconn Tech Co., Ltd.

发明人： LI, Yang ,  LI, Delong

IPC分类号： A61N5/00

CPC分类号： A61B18/203 ,  A61B2018/00005 ,  A61B2018/0047 ,  A61B2018/00476 ,  A61N5/00 ,  A61N5/0616 ,  A61N2005/007 ,  A61N2005/0652 ,  A61N2005/0665 ,  H01S5/005 ,  H01S5/02252 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/423

摘要： Disclosed is a high power VCSEL (vertical-cavity surface-emitting laser) laser treatment device with a skin cooling function, comprising VCSEL array (4) packaged on a laser heat sink (2), an optical transmission device (8) arranged in front of light-exiting faces of the VCSEL array (4) and a high-heat-conductivity optical window sheet (6) adhered to the light-exiting port end of the optical transmission device (8). An integrally molded cooling conduction metal piece (1) is arranged on the outer sides of the laser heat sink (2), the optical transmission device (8) and the high-heat-conductivity optical window sheet (6). In addition, one or more semiconductor chilling plates (7) are arranged between the cooling conduction metal piece (1) and the laser heat sink (2), wherein the hot ends of the semiconductor chilling plates (7) are in contact with the laser heat sink (2) and the cold ends of the semiconductor chilling plates (7) are in contact with the cooling conduction metal piece (1). In the above-mentioned high power VCSEL semiconductor laser treatment device, the semiconductor chilling plates (7) and the VCSEL array (4) share the heat sink, so that the inner structure is simplified. Therefore, the laser treatment device has the advantages of being simple in structure, powerful in function, easy to manufacture, high in reliability and the like, thus having broad application prospects in the field of laser medicine.

摘要翻译： 公开了一种具有皮肤冷却功能的高功率VCSEL（垂直腔表面发射激光）激光治疗装置，包括封装在激光散热器（2）上的VCSEL阵列（4），布置在前面的光传输装置（8） VCSEL阵列（4）的光出射面和粘附在光传输装置（8）的出光端口端的高导热光学窗口片（6）。 在激光散热器（2），光传输装置（8）和高导热性光学窗板（6）的外侧设置一体成型的冷却传导金属片（1）。 此外，在冷却传导金属片（1）和激光散热器（2）之间布置有一个或多个半导体冷却板（7），其中半导体冷却板（7）的热端与激光器 散热器（2）和半导体冷却板（7）的冷端与冷却传导金属件（1）接触。 在上述高功率VCSEL半导体激光处理装置中，半导体激冷板（7）和VCSEL阵列（4）共用散热器，从而简化了内部结构。 因此，该激光治疗装置具有结构简单，功能强大，制造容易，可靠性高等优点，在激光医学领域具有广阔的应用前景。