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    Semiconductor device and manufacturing method of the same
    1.
    发明公开
    Semiconductor device and manufacturing method of the same 审中-公开
    半导体器件及其制造方法

    公开(公告)号：EP1798768A3

    公开(公告)日：2009-07-08

    申请号：EP06026027.0

    申请日：2006-12-15

    申请人： Sanyo Electric Co., Ltd.

    发明人： Noma, Takashi ,  Okada, Kazuo ,  Ishibe, Shinzo ,  Kitagawa, Katsuhiko ,  Morita, Yuichi ,  Otsuka, Shigeki ,  Yamada, Hiroshi ,  Okubo, Noboru ,  Shinogi, Hiroyuki ,  Okigawa, Mitsuru

    IPC分类号： H01L27/146 ,  H01L31/0203

    CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/10 ,  H01L2924/00014

    摘要： This invention provides a semiconductor device that solves a problem that a pattern of a wiring formed on a back surface of a semiconductor substrate (2) is reflected on an output image. A light receiving element (1) (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an illumination sensor) is formed on a front surface of a semiconductor substrate (2), and a plurality of ball-shaped conductive terminals (11) is disposed on a back surface of the semiconductor substrate (2). Each of the conductive terminals (11) is electrically connected to a pad electrode (e) on the front surface of the semiconductor substrate (2) through a wiring layer (9). The wiring layers (9) and the conductive terminals (11) are formed on the back surface of the semiconductor substrate (2) except in a region overlapping the light receiving element (1) in a vertical direction, and are not disposed in a region overlapping the light receiving element (1).

    摘要翻译： 本发明提供了一种半导体器件，其解决了在输出图像上反映在半导体衬底（2）的背表面上形成的布线的图案的问题。 在半导体衬底（2）的前表面上形成光接收元件（1）（例如CCD，红外线传感器，CMOS传感器或照明传感器），并且多个球形导电端子 11）设置在半导体衬底（2）的后表面上。 每个导电端子（11）通过布线层（9）电连接到半导体衬底（2）的前表面上的焊盘电极（e）。 布线层（9）和导电端子（11）形成在半导体基板（2）的背面，除了在垂直方向上与光接收元件（1）重叠的区域之外，并且不布置在区域 与光接收元件（1）重叠。

    Semiconductor device and manufacturing method of the same
    4.
    发明公开
    Semiconductor device and manufacturing method of the same 审中-公开
    Halbleiterbauelement和sein Herstellungsverfahren

    公开(公告)号：EP1798768A2

    公开(公告)日：2007-06-20

    申请号：EP06026027.0

    申请日：2006-12-15

    申请人： Sanyo Electric Co., Ltd.

    发明人： Noma, Takashi ,  Okada, Kazuo ,  Ishibe, Shinzo ,  Kitagawa, Katsuhiko ,  Morita, Yuichi ,  Otsuka, Shigeki ,  Yamada, Hiroshi ,  Okubo, Noboru ,  Shinogi, Hiroyuki ,  Okigawa, Mitsuru

    IPC分类号： H01L27/146 ,  H01L31/0203

    CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/10 ,  H01L2924/00014

    摘要： This invention provides a semiconductor device that solves a problem that a pattern of a wiring formed on a back surface of a semiconductor substrate (2) is reflected on an output image. A light receiving element (1) (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an illumination sensor) is formed on a front surface of a semiconductor substrate (2), and a plurality of ball-shaped conductive terminals (11) is disposed on a back surface of the semiconductor substrate (2). Each of the conductive terminals (11) is electrically connected to a pad electrode (e) on the front surface of the semiconductor substrate (2) through a wiring layer (9). The wiring layers (9) and the conductive terminals (11) are formed on the back surface of the semiconductor substrate (2) except in a region overlapping the light receiving element (1) in a vertical direction, and are not disposed in a region overlapping the light receiving element (1).

    摘要翻译： 本发明提供了一种半导体器件，其解决了形成在半导体衬底（2）的背表面上的布线的图案在输出图像上被反射的问题。 在半导体基板（2）的前表面上形成有光接收元件（1）（例如CCD，红外线传感器，CMOS传感器或照明传感器）和多个球形导电端子 11）设置在半导体基板（2）的背面。 每个导电端子（11）通过布线层（9）与半导体衬底（2）的前表面上的焊盘电极（e）电连接。 布线层（9）和导电端子（11）形成在半导体基板（2）的背面上，除了在垂直方向上与光接收元件（1）重叠的区域之外，不布置在区域 与光接收元件（1）重叠。