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1.发明授权PLASMA-CVD-ANLAGE MIT EINEM ARRAY VON MIKROWELLEN-PLASMAELEKTRODEN UND PLASMA-CVD-VERFAHREN 失效微波等离子电极和等离子体CVD法的数组等离子体CVD系统
公开(公告)号：EP0922122B1
公开(公告)日：2003-03-12
申请号：EP97940121.3
申请日：1997-08-23
发明人： WALTHER, Marten , MÖHL, Wolfgang , DANIELZIK, Burkhard , KUHR, Markus , HOCHHAUS, Roland , BAUCH, Hartmut , HEMING, Martin , KÜPPER, Thomas , BEWIG, Lars
IPC分类号： C23C16/52
CPC分类号： H01J37/32192 , C23C16/402 , C23C16/511 , C23C16/545
摘要： The invention concerns a plasma CVD system (in particular a plasma pulse CVD system) with an array of microwave plasma electrodes (2a, b, c, d). According to the invention, in order to improve the homogeneity of the layer, interference is prevented by controlling adjacent plasma electrodes (2a, 2b; 2b, 2c; 2c, 2d) in a chronologically offset manner. To that end, micropulses (A, B) are provided within the macropulses of the plasma pulse CVD process. Additionally, the uniformity of the layer deposition at the interfaces between adjacent modules can be optimized by radio-frequency excitation by means of suitable electrodes (6, 62a-c), magnetic fields or the configuration of the gas inlets (5). The surface coated in an operating cycle can thus be scaled as required.
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2.发明公开PLASMA-CVD-ANLAGE MIT EINEM ARRAY VON MIKROWELLEN-PLASMAELEKTRODEN UND PLASMA-CVD-VERFAHREN 失效微波等离子电极和等离子体CVD法的数组等离子体CVD系统
公开(公告)号：EP0922122A1
公开(公告)日：1999-06-16
申请号：EP97940121.0
申请日：1997-08-23
发明人： WALTHER, Marten , MÖHL, Wolfgang , DANIELZIK, Burkhard , KUHR, Markus , HOCHHAUS, Roland , BAUCH, Hartmut , HEMING, Martin , KÜPPER, Thomas , BEWIG, Lars
CPC分类号： H01J37/32192 , C23C16/402 , C23C16/511 , C23C16/545
摘要： The invention concerns a plasma CVD system (in particular a plasma pulse CVD system) with an array of microwave plasma electrodes (2a, b, c, d). According to the invention, in order to improve the homogeneity of the layer, interference is prevented by controlling adjacent plasma electrodes (2a, 2b; 2b, 2c; 2c, 2d) in a chronologically offset manner. To that end, micropulses (A, B) are provided within the macropulses of the plasma pulse CVD process. Additionally, the uniformity of the layer deposition at the interfaces between adjacent modules can be optimized by radio-frequency excitation by means of suitable electrodes (6, 62a-c), magnetic fields or the configuration of the gas inlets (5). The surface coated in an operating cycle can thus be scaled as required.
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