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1.发明公开
公开(公告)号：EP1275503A2
公开(公告)日：2003-01-15
申请号：EP02254490.2
申请日：2002-06-26
IPC分类号： B41J2/085
CPC分类号： H05K3/4691 , B41J2/085 , H05K1/0306 , H05K3/205 , H05K3/4007 , H05K2201/0367
摘要： Metallic bumps (22) are formed for electrical interconnection between the charge plate (10) and the charge drive electronics. This is achieved by having improved electrical connection between an ink jet charge plate (10) and associated charge leads is promoted. This is achieved by integrating the termination pads (22), electrical transmission lines, and charging leads. The termination bumps (22) are formed as integral parts of the charge leads and are connected directly to the charge driver board electronics by pressure contact. The bumps (22) can be formed by mechanically indenting the termination pads (30) or by using an interposer that has raised metallic pads aligned to the integral nickel pads and the charge driver circuitry board. First, a mask is aligned to permit additive formation of the pads, conductors, and charge leads. Then the nickel circuitry (26) thus formed is made into a rigid charge plate and an integrated flexible section (18) having contact bumps (22). After bonding the rigid and flexible substrates to the electroformed circuitry the copper substrate (28) is completely removed by selective etching, thus exposing the mechanically deformed bumps (22) on the lead terminations, one for each charge lead. The bump thus formed is used to provide a high pressure point electrical connection to the charge plate.
摘要翻译： 形成金属凸块（22）以用于电荷板（10）和充电驱动电子设备之间的电互连。 这是通过改进喷墨充电板（10）和相关充电引线之间的电连接来实现的。 这通过集成端接垫（22），电传输线和充电引线来实现。 终端凸块（22）形成为充电引线的整体部分，并通过压力接触直接连接到充电驱动板电路。 凸块（22）可以通过机械地缩进终端垫（30）或通过使用具有与整体镍垫和充电驱动器电路板对齐的凸起金属垫的插入件来形成。 首先，将掩模对齐以允许焊盘，导体和电荷引线的添加剂形成。 然后将如此形成的镍电路（26）制成刚性电荷板和具有接触凸块（22）的集成柔性部分（18）。 在将刚性和柔性基板粘合到电铸电路之后，通过选择性蚀刻完全去除铜基板（28），从而暴露引线端子上的机械变形凸块（22），每个充电引线一个。 如此形成的凸块用于提供与充电板的高压点电连接。
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2.发明公开Mandrel with controlled release layer for multi-layer electroformed ink jet orifice plates 有权一种用于使用心轴用控释层的多层喷墨喷嘴板的电铸处理
公开(公告)号：EP1332879A1
公开(公告)日：2003-08-06
申请号：EP03250366.6
申请日：2003-01-21
发明人： Sexton, Richard W.
IPC分类号： B41J2/16
CPC分类号： C25D1/08 , B41J2/162 , B41J2/1625 , C25D1/10 , C25D1/22 , Y10T428/1476
摘要： A system and method are provided for fabricating an orifice plate (14) for use in an ink jet printing system. Initially, a substrate base (16) is provided, and a controlled-release layer (18) is applied to a surface of the substrate base (16). A conductive metal layer (20) is adherently coated on the controlled-release layer (18). At least one dielectric peg (22) is created on a portion of the conductive metal layer (20), and a nozzle layer (24) is applied on the conductive metal layer (20) to partially cover the dielectric peg (22). Photolithography is used to define a trench that covers the nozzles prior to formation of a second reinforcing layer. The controlled-release layer (18) is removed to separate the orifice plate (14) from the substrate base (12). The conductive metal layer (20) is selectively etched from the nozzle layer (24) to produce a completed multi-layer orifice plate (14).
摘要翻译： 本发明提供一种系统和方法，用于在喷墨打印系统在孔板（14），用于使用制造。最初，提供一个基片基座（16），和控制释放层（18）被施加到的一个表面 基底基板（16）。 的导电金属层（20）被贴壁涂覆控释层（18）上。 至少一个电介质塞销（22）在导电金属层（20）的一部分创建的，并且喷嘴层（24）施加所述导电金属层（20）上以部分地覆盖所述介电销（22）。 光刻用于定义沟槽做覆盖之前形成第二增强层的喷嘴。 控释层（18）被去除，以从所述基底基板（12）的喷孔板（14）分开。 所述导电金属层（20）从喷嘴层（24），以产生完成的多层孔板（14）选择性地蚀刻。
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公开(公告)号：EP0613778B1
公开(公告)日：1998-06-10
申请号：EP94301322.7
申请日：1994-02-24
发明人： Sexton, Richard W.
IPC分类号： B41J2/085
CPC分类号： B41J2/085
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4.发明公开
公开(公告)号：EP1275503A3
公开(公告)日：2003-09-10
申请号：EP02254490.2
申请日：2002-06-26
CPC分类号： H05K3/4691 , B41J2/085 , H05K1/0306 , H05K3/205 , H05K3/4007 , H05K2201/0367
摘要： Metallic bumps (22) are formed for electrical interconnection between the charge plate (10) and the charge drive electronics. This is achieved by having improved electrical connection between an ink jet charge plate (10) and associated charge leads is promoted. This is achieved by integrating the termination pads (22), electrical transmission lines, and charging leads. The termination bumps (22) are formed as integral parts of the charge leads and are connected directly to the charge driver board electronics by pressure contact. The bumps (22) can be formed by mechanically indenting the termination pads (30) or by using an interposer that has raised metallic pads aligned to the integral nickel pads and the charge driver circuitry board. First, a mask is aligned to permit additive formation of the pads, conductors, and charge leads. Then the nickel circuitry (26) thus formed is made into a rigid charge plate and an integrated flexible section (18) having contact bumps (22). After bonding the rigid and flexible substrates to the electroformed circuitry the copper substrate (28) is completely removed by selective etching, thus exposing the mechanically deformed bumps (22) on the lead terminations, one for each charge lead. The bump thus formed is used to provide a high pressure point electrical connection to the charge plate.
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公开(公告)号：EP1013433A3
公开(公告)日：2000-08-23
申请号：EP99309503.3
申请日：1999-11-29
IPC分类号： B41J2/16
CPC分类号： B41J2/1623 , B41J2/162
摘要： An orifice plate for an ink jet printing system has improved fabrication. The orifice plates (10) are formed as part of a larger panel (12). They are mechanically attached to the larger panel and electrically connected to it by means a large number of uniformly space narrow bridge members (18). These bridge members each converge to a narrow point at the edge of the orifice plate to cause the bridge to detach from the edge of the orifice plate when the orifice plate is to be removed from the larger panel at the time of orifice plate bonding.
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公开(公告)号：EP1013433A2
公开(公告)日：2000-06-28
申请号：EP99309503.3
申请日：1999-11-29
IPC分类号： B41J2/16
CPC分类号： B41J2/1623 , B41J2/162
摘要： An orifice plate for an ink jet printing system has improved fabrication. The orifice plates (10) are formed as part of a larger panel (12). They are mechanically attached to the larger panel and electrically connected to it by means a large number of uniformly space narrow bridge members (18). These bridge members each converge to a narrow point at the edge of the orifice plate to cause the bridge to detach from the edge of the orifice plate when the orifice plate is to be removed from the larger panel at the time of orifice plate bonding.
摘要翻译： 用于喷墨打印系统的孔板具有改进的制造。 孔板（10）形成为较大面板（12）的一部分。 它们机械地连接到较大的面板并通过大量均匀空间狭窄的桥接构件（18）与其电连接。 这些桥接件各自会聚在孔板边缘的一个窄点上，以便当在孔板粘接时将孔板从较大的板上移开时使桥接件从孔板的边缘脱离。
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7.发明公开Passivation layer for ceramic based charge plates 失效PassivierungsschichtfürLadungselektroden auf Basis von Keramik。
公开(公告)号：EP0613778A3
公开(公告)日：1995-04-05
申请号：EP94301322.7
申请日：1994-02-24
发明人： Sexton, Richard W.
IPC分类号： B41J2/085
CPC分类号： B41J2/085
摘要： A charge plate structure for use in a continuous ink jet printer is provided with a protective layer of adhesively bonded polyimide film. The charge plate is fabricated by forming a substrate having charging electrodes along one edge and corresponding conductive leads on one surface. The surface of the charge plate is precleaned and the polyimide film is laminated thereto by means of heat and pressure. The resulting charge plate exhibits improved adhesion and protection from ink.
摘要翻译： 用于连续喷墨打印机的充电板结构设置有粘合聚酰亚胺膜的保护层。 通过沿着一个边缘形成具有充电电极的基板和在一个表面上形成相应的导电引线来制造充电板。 预充电电荷板的表面，并通过热和压力将聚酰亚胺膜层压到其上。 所得到的充电板表现出改善的粘附性和防止油墨的侵害。
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公开(公告)号：EP0613778A2
公开(公告)日：1994-09-07
申请号：EP94301322.7
申请日：1994-02-24
发明人： Sexton, Richard W.
IPC分类号： B41J2/085
CPC分类号： B41J2/085
摘要： A charge plate structure for use in a continuous ink jet printer is provided with a protective layer of adhesively bonded polyimide film. The charge plate is fabricated by forming a substrate having charging electrodes along one edge and corresponding conductive leads on one surface. The surface of the charge plate is precleaned and the polyimide film is laminated thereto by means of heat and pressure. The resulting charge plate exhibits improved adhesion and protection from ink.
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