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公开(公告)号:EP3923326A1
公开(公告)日:2021-12-15
申请号:EP20753265.6
申请日:2020-02-06
发明人: LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
摘要: A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
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公开(公告)号:EP3975270A1
公开(公告)日:2022-03-30
申请号:EP20810370.5
申请日:2020-05-14
发明人: LEE, Seom Geun , JANG, Seong Kyu , SHIN, Chan Seob , LEE, Ho Joon
IPC分类号: H01L33/00
摘要: A light-emitting element for a display, according to one embodiment, comprises: a first LED stack; a second LED stack positioned below the first LED stack; a third LED stack positioned below the second LED stack; a first bonding layer interposed between the second LED stack and the third LED stack; a second bonding layer interposed between the first LED stack and the second LED stack; a lower insulation layer interposed between the second bonding layer and the second LED stack; first lower buried layers electrically connected to a first conductive semiconductor layer and a second conductive semiconductor layer, respectively, of the third LED stack by penetrating the lower insulation layer and the second LED stack; first upper buried layers electrically connected to the first lower buried layers by penetrating the first LED stack and the second bonding layer; and a plurality of upper connectors arranged on the first LED stack, wherein the upper connectors include upper connectors electrically connected to the first upper buried layers by covering the first upper buried layers.
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公开(公告)号:EP3940775A1
公开(公告)日:2022-01-19
申请号:EP20771030.2
申请日:2020-03-12
发明人: JANG, Seong Kyu , SHIN, Chan Seob , LEE, Seom Geun , LEE, Ho Joon
IPC分类号: H01L25/075 , H01L33/38 , H01L33/62 , H01L33/42 , H01L33/00
摘要: A light emitting element for a display according to an embodiment comprises: a first LED stack; a second LED stack disposed below the first LED stack; a third LED stack disposed below the second LED stack; and bump pads disposed on the first LED stack, wherein each of the first to third LED stacks includes a first conductive semiconductor layer and a second conductive semiconductor layer disposed below the first conductive semiconductor layer. The first LED stack includes a first conductive semiconductor layer exposed through a second conductive semiconductor layer, and has upper through-holes passing through the first conductive semiconductor layer, the second LED stack includes a first conductive semiconductor layer exposed through a second conductive semiconductor layer, and has lower through-holes passing through the first conductive semiconductor layer, the third LED stack includes a first conductive semiconductor layer exposed through a second conductive semiconductor layer, and the bump pads are electrically connected to the second LED stack and the third LED stack by using the upper through-holes and the lower through-holes.
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公开(公告)号:EP4407697A2
公开(公告)日:2024-07-31
申请号:EP24169073.4
申请日:2020-02-06
发明人: LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
IPC分类号: H01L33/00
CPC分类号: H01L33/42 , H01L33/62 , H01L25/0756 , H01L33/382
摘要: A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
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公开(公告)号:EP3876281A1
公开(公告)日:2021-09-08
申请号:EP19878906.7
申请日:2019-11-01
摘要: Provided is a light emitting element. The light emitting device comprises: a first light emitting unit having a first area; a second light emitting unit having a second area; and a third light emitting unit having a third area, wherein the first light emitting unit is coplanar with the second light emitting unit, and the third light emitting unit is disposed over the first and second light emitting units, and the third area is larger than each of the first and second areas.
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6.
公开(公告)号:EP3346511A1
公开(公告)日:2018-07-11
申请号:EP16842174.1
申请日:2016-08-23
CPC分类号: H01L33/42 , G02F1/133603 , H01L33/00 , H01L33/10 , H01L33/325 , H01L33/387 , H01L33/46 , H01L33/62
摘要: A light-emitting electrode having a ZnO transparent electrode and a method for manufacturing the same are provided. A light-emitting element according to an embodiment comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; and a ZnO transparent electrode, which is positioned on the second conductive semiconductor layer, which makes an Ohmic contact with the second conductive semiconductor layer, and which comprises monocrystalline ZnO, wherein the diffraction angle of a peak of the ZnO transparent electrode, which results from X-ray diffraction (XRD) omega 2theta (ω2θ) scan, is in the range of ±1% with regard to the diffraction angle of a peak of the second conductive semiconductor layer, which results from XRD ω2θ scan, and the FWHM of a main peak of the ZnO transparent electrode, which results from XRD omega (ω) scan, is equal to or less than 900 arcsec.
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公开(公告)号:EP4407697A3
公开(公告)日:2024-11-06
申请号:EP24169073.4
申请日:2020-02-06
发明人: LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
摘要: A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
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8.
公开(公告)号:EP3961299A1
公开(公告)日:2022-03-02
申请号:EP20795899.2
申请日:2020-04-23
发明人: JANG, Seong Kyu , LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon
IPC分类号: G02F1/135
摘要: A display panel according to one embodiment comprises: a circuit board having pads; light-emitting elements electrically connected to the pads and arranged on the circuit board; and a buffer material layer disposed between the circuit board and the light-emitting elements so as to fill a space between the circuit board and the light-emitting elements, wherein the buffer material layer is located under the upper surfaces of the light-emitting elements.
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公开(公告)号:EP3876294A1
公开(公告)日:2021-09-08
申请号:EP19880003.9
申请日:2019-11-01
摘要: A light-emitting diode is provided. A light-emitting diode comprises: a first light-emitting unit comprising a 1-1 type semiconductor layer, a first active layer and a 1-2 type semiconductor layer; a second light-emitting unit disposed on the first light-emitting unit and comprising a 2-1 type semiconductor layer, a second active layer and a 2-2 type semiconductor layer; a third light-emitting unit disposed on the second light-emitting unit and comprising a 3-1 type semiconductor layer, a third active layer and a 3-2 type semiconductor layer; a first conductive pattern comprising a first part, which is disposed inside the second light-emitting unit and is electrically connected to at least one of the 1-1 type, 1-2 type, 2-1 type and 2-2 type semiconductor layers, and a second part which extends from the first part to one surface of the second light-emitting unit between the second and third light-emitting units; and a second conductive pattern which is disposed on the third light-emitting unit and is electrically connected to the first conductive pattern, wherein the second conductive pattern comprises an area which at least partly overlaps the second part of the first conductive pattern.
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