-
公开(公告)号：EP4020552A1
公开(公告)日：2022-06-29
申请号：EP20855589.6
申请日：2020-07-31
摘要： A light-emitting element for a display according to an embodiment comprises: a first LED stack for generating light having a first peak wavelength; a second LED stack disposed below the first LED stack and generating light having a second peak wavelength; a third LED stack disposed below the second LED stack and generating light having a third peak wavelength; and a floating reflective layer disposed above the first LED stack and reflecting the light having the first peak wavelength, wherein the first peak wavelength is a longer wavelength than the second and third peak wavelengths.
-
公开(公告)号：EP3923326A1
公开(公告)日：2021-12-15
申请号：EP20753265.6
申请日：2020-02-06
发明人： LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
摘要： A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
-
公开(公告)号：EP4407697A2
公开(公告)日：2024-07-31
申请号：EP24169073.4
申请日：2020-02-06
发明人： LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , H01L33/62 , H01L25/0756 , H01L33/382
摘要： A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
-
公开(公告)号：EP3876281A1
公开(公告)日：2021-09-08
申请号：EP19878906.7
申请日：2019-11-01
摘要： Provided is a light emitting element. The light emitting device comprises: a first light emitting unit having a first area; a second light emitting unit having a second area; and a third light emitting unit having a third area, wherein the first light emitting unit is coplanar with the second light emitting unit, and the third light emitting unit is disposed over the first and second light emitting units, and the third area is larger than each of the first and second areas.
-
公开(公告)号：EP3852154A1
公开(公告)日：2021-07-21
申请号：EP19860392.0
申请日：2019-09-10
发明人： JANG, Seong Kyu , LEE, Ho Joon , CHAE, Jong Hyeon
摘要： A light emitting device is provided. The light emitting device includes a first light emitting part including a first ohmic layer, a second light emitting part and including a second ohmic layer, a third light emitting part including first and second metal patterns respectively contacting semiconductor layers thereof, a first pad electrically coupled with the first ohmic layer, a second pad electrically coupled with the second ohmic layer, a third pad electrically coupled with the first metal pattern, a common pad electrically coupled with a semiconductor layer of the first and second light emitting parts and the second metal pattern, and a via structure electrically coupling the second metal pattern and the common pad between the second metal pattern and the common pad, in which the second metal pattern has a first portion contacting the first via structure and a second portion contacting the semiconductor layer of the third light emitting part.
-
公开(公告)号：EP4407697A3
公开(公告)日：2024-11-06
申请号：EP24169073.4
申请日：2020-02-06
发明人： LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon , JANG, Seong Kyu
摘要： A light-emitting element for a display according to one embodiment comprises: a first LED lamination; a second LED lamination; a third LED lamination; a first transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the lower surface of the first LED lamination; a second transparent electrode interposed between the first LED lamination and the second LED lamination and being in ohmic contact with the upper surface of the second LED lamination; a third transparent electrode interposed between the second LED lamination and the third LED lamination and being in ohmic contact with the upper surface of the third LED lamination; an n electrode pad disposed on a first conductive semiconductor layer of the third LED lamination; a lower p electrode pad disposed on the third transparent electrode; and bump pads arranged on the first LED lamination, wherein the upper surface of the n electrode pad is located at the same height as that of the upper surface of the lower p electrode pad.
-
7.发明公开
公开(公告)号：EP3961299A1
公开(公告)日：2022-03-02
申请号：EP20795899.2
申请日：2020-04-23
发明人： JANG, Seong Kyu , LEE, Seom Geun , SHIN, Chan Seob , LEE, Ho Joon
IPC分类号： G02F1/135
摘要： A display panel according to one embodiment comprises: a circuit board having pads; light-emitting elements electrically connected to the pads and arranged on the circuit board; and a buffer material layer disposed between the circuit board and the light-emitting elements so as to fill a space between the circuit board and the light-emitting elements, wherein the buffer material layer is located under the upper surfaces of the light-emitting elements.
-
公开(公告)号：EP3876294A1
公开(公告)日：2021-09-08
申请号：EP19880003.9
申请日：2019-11-01
摘要： A light-emitting diode is provided. A light-emitting diode comprises: a first light-emitting unit comprising a 1-1 type semiconductor layer, a first active layer and a 1-2 type semiconductor layer; a second light-emitting unit disposed on the first light-emitting unit and comprising a 2-1 type semiconductor layer, a second active layer and a 2-2 type semiconductor layer; a third light-emitting unit disposed on the second light-emitting unit and comprising a 3-1 type semiconductor layer, a third active layer and a 3-2 type semiconductor layer; a first conductive pattern comprising a first part, which is disposed inside the second light-emitting unit and is electrically connected to at least one of the 1-1 type, 1-2 type, 2-1 type and 2-2 type semiconductor layers, and a second part which extends from the first part to one surface of the second light-emitting unit between the second and third light-emitting units; and a second conductive pattern which is disposed on the third light-emitting unit and is electrically connected to the first conductive pattern, wherein the second conductive pattern comprises an area which at least partly overlaps the second part of the first conductive pattern.
-
公开(公告)号：EP4060753A1
公开(公告)日：2022-09-21
申请号：EP20887672.2
申请日：2020-11-13
IPC分类号： H01L33/38 , H01L33/08 , H01L33/42 , H01L25/075 , H01L27/12
摘要： A light-emitting device for display according to an embodiment comprises: a first LED stack; a second LED stack located under the first LED stack; a third LED stack located under the second LED stack; a first bonding layer interposed between the second LED stack and the third LED stack; a second bonding layer interposed between the first LED stack and the second LED stack; a first planarization layer interposed between the second bonding layer and the second LED stack; a second planarization layer arranged on the first LED stack; first lower buried vias which are electrically connected respectively to a first conductive-type semiconductor layer and a second conductive-type semiconductor layer in the third LED stack after penetrating through the first planarization layer, the second LED stack, and the first bonding layer; and upper buried vias penetrating through the second planarization layer and the first LED stack, wherein widths of upper ends of the first lower buried vias and the upper buried vias are greater than widths of corresponding through-holes.
-
公开(公告)号：EP4012765A1
公开(公告)日：2022-06-15
申请号：EP20849057.3
申请日：2020-08-04
IPC分类号： H01L25/075 , H01L33/08 , H01L33/38 , H01L23/522 , H01L33/10 , H01L33/42 , H01L23/485
摘要： A display panel according to an embodiment of the present disclosure comprises: a circuit board having pads on the upper surface thereof; and a plurality of pixel regions arranged on the circuit board, wherein each of the pixel regions comprises: a first LED stack disposed on the circuit board; a first bonding layer disposed between the first LED stack and the circuit board; a second LED stack disposed on the first LED stack; a third LED stack disposed on the second LED stack; first through-vias extending through the first LED stack and the first bonding layer; second through-vias extending through the second LED stack; and third through-vias extending through the third LED stack, and the first through-vias extend through the first LED stack and the first bonding layer, and are connected to the pads on the circuit board.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.012 秒)
