公开(公告)号：EP2860777A1

公开(公告)日：2015-04-15

申请号：EP13800218.3

申请日：2013-06-06

申请人： Shikoku Instrumentation Co., Ltd.

发明人： ISHIHARA, Masamichi ,  OYAMA, Kenshu ,  MURAKAMI, Shoji ,  ONOSAKA, Hitonobu ,  SHIMA, Masato

IPC分类号： H01L33/62 ,  H01L33/60

CPC分类号： H01L33/62 ,  F21V7/0066 ,  F21V23/023 ,  F21V29/70 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/60 ,  H01L33/641 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H05K1/0274 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00011

摘要： [Problem] An LED illumination apparatus is provided which has high brightness and emits a great amount of light, and which is compact and lightweight. [Solution] An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm 2 /cm 2 or more. An LED illumination apparatus including the LED illumination module is also provided.

摘要翻译： 【问题】提供了一种LED照明装置，其具有高亮度并且发出大量的光，其结构紧凑轻便。 [解决方案]一种LED照明模块，其中LED裸芯片以高密度安装在安装基板上，该模块包括许多具有相同规格的LED裸芯片，其至少表面为金属的安装基板和反射 LED裸芯片用树脂密封的区域，其中安装基板的反射区域的表面被用作反射构件的无机白色绝缘层覆盖，包括多个LED裸露的单元LED芯片组 串联连接的芯片多个，多个单位LED芯片组并联连接，整体光通量为10,000流明以上，反射区域的LED裸芯片的安装面积密度为15mm 2 / cm 2， 更多。 还提供了包括LED照明模块的LED照明装置。

公开(公告)号：EP2741341A1

公开(公告)日：2014-06-11

申请号：EP12820247.0

申请日：2012-07-31

申请人： Steq Inc. ,  SS Techno, Inc. ,  Shikoku Instrumentation Co., Ltd.

发明人： ISHIHARA, Masamichi ,  OYAMA, Kenshu ,  MURAKAMI, Shoji ,  ONOSAKA, Hitonobu

IPC分类号： H01L33/60 ,  H01L23/12 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： [Object] A semiconductor device is provided which includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. [Solution] In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO 2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material. Preferably, a rate of SiO 2 and the white insulating layer contained in the white insulating layer after the baking is 80 % by weight or greater.

摘要翻译： 本发明提供一种半导体器件，其包括具有优异的耐热性，散热性和耐久性的电绝缘层，并且该半导体器件通过具有良好成本性能和工艺性能的工艺制造。 解决方案在包括直接或间接地安装有半导体芯片的第一基板和形成在第一基板的表面上并且用作反射材料的白色绝缘层的半导体器件中，半导体芯片是LED， 至少第一基板的表面由金属制成，并且白色绝缘层和金属层的堆叠结构通过将包含纳米颗粒和白色无机颜料形式的SiO 2的液体材料涂覆在 第一衬底的表面并烘烤涂覆的液体材料。 优选地，烧制后的白色绝缘层中包含的SiO 2和白色绝缘层的比率为80重量％以上。