-
公开(公告)号：EP3070748B1
公开(公告)日：2018-07-25
申请号：EP14859723.0
申请日：2014-10-30
发明人： YAMAKAWA, Naoki , IGARASHI, Minoru , YAGINUMA, Atsushi , FURIHATA, Tomoyoshi , OHWADA, Hiroto , TSUKADA, Junichi , ITO, Atsuo
IPC分类号： H01L31/048 , C09J183/04
CPC分类号： H01L31/0481 , C08G77/12 , C08G77/20 , C08K3/22 , C08K3/36 , C08K5/56 , C08L83/00 , C09J9/00 , C09J183/04 , C09J183/06 , C09J183/08 , Y02E10/50
摘要： This silicone adhesive sheet, which has ultraviolet ray shielding properties and is for sealing a solar cell, and which forms a silicone adhesive layer contacting a back surface panel in a solar cell module provided with a light-receiving surface panel, a back surface panel, a silicone adhesive layer contacting both surface panels, and a plurality of solar cells that are sealed by being interposed between both adhesive layers, is characterized by imparting a light transmission rate of no greater than 30% when measuring the light transmission rate at a wavelength of 380 nm to a cured product having a thickness of 2 mm. The silicone adhesive sheet is of a millable type able to capable of extrusion molding, calendering molding, and the like, and modularization using a vacuum laminator is possible of a laminate of a light-receiving surface panel, a silicone adhesive sheet, a solar cell, the silicone adhesive sheet of the present invention, and a back surface panel (back sheet).
-
公开(公告)号：EP4432346A1
公开(公告)日：2024-09-18
申请号：EP22892599.6
申请日：2022-10-26
摘要： The present invention is a cover for a heat generating electronic component including a hollow structure having one or more openings for inserting an electronic circuit component, wherein an inner wall surface of the hollow structure has one or more protrusion portions. Thereby, a cover for a heat generating electronic component that can prevent detachment of the electronic component is provided.
-
公开(公告)号：EP4349916A1
公开(公告)日：2024-04-10
申请号：EP22816078.4
申请日：2022-05-31
发明人： TSUKADA, Junichi
IPC分类号： C08L83/07 , C08K5/3495 , C08L83/04 , C08L83/05 , C08L83/06
摘要： Provided is a thermally conductive silicone composition capable of being turned into a cured product that is superior in heat dissipation property and is able to suppress corrosion of metal wirings. The thermally conductive silicone composition contains:
(A) an organopolysiloxane having at least 2 silicon atom-bonded alkenyl groups per molecule, and having a kinetic viscosity of 10 to 100,000 mm 2 /s at 25°C;
(B) an organohydrogenpolysiloxane having, per molecule, at least 2 hydrogen atoms that are directly bonded to silicon atoms;
(C) a thermally conductive filler having a thermal conductivity of not lower than 10 W/m·K;
(D) a dimethylpolysiloxane with one molecular chain end being blocked by a trialkoxy group;
(E) a platinum group metal-based curing catalyst;
(F) benzotriazole and/or a benzotriazole derivative; and
(G) an aliphatic unsaturated bond-free organopolysiloxane.-
公开(公告)号：EP4082970A1
公开(公告)日：2022-11-02
申请号：EP20908282.5
申请日：2020-12-08
发明人： ITO, Takanori , ENDO, Akihiro , TSUKADA, Junichi
摘要： One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E):
(A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass,
(B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that the ratio of the number of the hydrogen atoms bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2,
(C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass,
(D) a catalytic amount of an addition-reaction catalyst, and
(E) an addition-reaction controlling agent in an amount of 0.01 to 1 parts by mass,
wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m 2 /g or less in an amount of 20 to 50 wt %, and aluminum hydroxide in an amount of 10 to 30 wt%, relative to the total weight of component (C).-
公开(公告)号：EP3872135A1
公开(公告)日：2021-09-01
申请号：EP19876590.1
申请日：2019-08-05
摘要： This invention is a thermal conductive silicone composition containing: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms in such an amount that the number of moles of hydrogen atoms directly bonded to silicon atoms is 0.1 to 5.0 times the number of moles of alkenyl groups derived from the component (A); (C) 2,800 to 4,000 parts by mass of a heat conductive filler including 50 mass% or more of a mixture of 25 to 35 mass% of aluminum hydroxide having an average particle size of 0.1 µm or more and less than 40 µm and 65 to 75 mass% of aluminum hydroxide having an average particle size of 40 µm or more and 100 µm or less; and (D) a platinum group metal-based curing catalyst having a mass-based platinum group metal element content of 0.1 to 1,000 ppm relative to the component (A). This provides a thermal conductive silicone composition and a cured product thereof which result in a thermal conductive silicone cured product having both thermal conduction and light weight.
-
-
-
-
搜索结果
5 条记录 (耗时 0.012 秒)
