公开(公告)号：EP1308541A1

公开(公告)日：2003-05-07

申请号：EP01308480.1

申请日：2001-10-04

申请人： Shipley Company LLC

发明人： Cobley, Andrew J. ,  Kapeckas, Mark J. ,  Reddington, Erik ,  Sonnenberg, Wade ,  Gabe, David R. ,  Buckley, Thomas ,  Barstad, Leon R.

IPC分类号： C25D3/38 ,  C25D3/02 ,  C25D3/26 ,  C23C18/16

CPC分类号： C25D3/38 ,  C25D3/02 ,  H05K3/242

摘要： A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brighteness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

摘要翻译： 金属电镀浴和在基板上镀金属的方法。 金属镀浴含有羟胺，其抑制添加剂浴组分的消耗以提高金属电镀工艺的效率。 将添加剂浴组分添加到金属电镀浴中以改善电镀金属的光泽度以及镀液的微投和抛光力。 除了增白剂之外，添加剂浴组分可以包括矫平剂，抑制剂，硬化剂等。 抑制添加剂消耗的羟胺可以用于镀铜，金，银，铂，钯，钴，镉，镍，铋，铟，锡，铑，铱，钌及其合金的金属电镀浴中。