Method of recycling Cd-112 isotope
    1.
    发明公开
    Method of recycling Cd-112 isotope 有权
    回收Cd-112同位素的方法

    公开(公告)号:EP2014778A2

    公开(公告)日:2009-01-14

    申请号:EP07110847.6

    申请日:2007-06-22

    IPC分类号: C22B17/00 C01G11/00 C25D3/26

    摘要: Cd-112 isotope is recycled from a Cd-112 chemical separated solution or a remainder of an electroplating solution having a Cd-112 target. The present invention recycles Cd-112 isotope with a low cost, a high purity and a high recycle rate. The recycled Cd-112 isotope can be be easily stored. The Cd-112 isotope can be used as an imaging agent in nuclear medicine.

    摘要翻译: Cd-112同位素从Cd-112化学分离溶液或具有Cd-112靶标的电镀溶液的其余部分循环。 本发明以低成本,高纯度和高回收率回收Cd-112同位素。 回收的Cd-112同位素可以很容易地储存。 Cd-112同位素可以用作核医学中的显像剂。

    Plating bath and method for depositing a metal layer on a substrate
    2.
    发明公开
    Plating bath and method for depositing a metal layer on a substrate 审中-公开
    Beschichtungsbad und Methode zur Abscheidung einer Metallschicht auf einem Substrat

    公开(公告)号:EP1308541A1

    公开(公告)日:2003-05-07

    申请号:EP01308480.1

    申请日:2001-10-04

    CPC分类号: C25D3/38 C25D3/02 H05K3/242

    摘要: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brighteness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

    摘要翻译: 金属电镀浴和在基板上镀金属的方法。 金属镀浴含有羟胺,其抑制添加剂浴组分的消耗以提高金属电镀工艺的效率。 将添加剂浴组分添加到金属电镀浴中以改善电镀金属的光泽度以及镀液的微投和抛光力。 除了增白剂之外,添加剂浴组分可以包括矫平剂,抑制剂,硬化剂等。 抑制添加剂消耗的羟胺可以用于镀铜,金,银,铂,钯,钴,镉,镍,铋,铟,锡,铑,铱,钌及其合金的金属电镀浴中。

    ELECTROPLATING BATHS
    7.
    发明公开
    ELECTROPLATING BATHS 审中-公开
    BADFÜRDIE ELEKTROBESCHICHTUNG

    公开(公告)号:EP1086262A4

    公开(公告)日:2002-01-02

    申请号:EP00915016

    申请日:2000-03-17

    CPC分类号: C25D3/32 C25D3/02

    摘要: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in various types of electroplating baths (e.g., sulfate, sulfonic acid, fluoroborate, and halide baths) has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability.

    摘要翻译: 使用烷基和链烷醇磺酸的碱金属,碱土金属,铵和取代的铵盐作为各种类型的电镀浴(例如硫酸盐,磺酸,氟硼酸盐和卤化物浴)中的添加剂具有许多意想不到的好处,包括 更广泛的有用电流密度范围,改进的外观和锡改善氧化稳定性的情况。